ATS-07E-204-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.43°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to the ATS-07E-204-C2-R0 Thermal - Heat Sink

The ATS-07E-204-C2-R0 Thermal - Heat Sink is a unique product in the thermal cooling industry. It has been designed to provide an effective solution to unwanted and excess heat buildup in electronic devices. This article will provide an overview of the product, its applications and working principles.

Applications

The ATS-07E-204-C2-R0 Thermal - Heat Sink is used in a variety of electronic devices such as computers, cell phones, medical equipment, and other electronics. It is designed to dissipate heat generated by electronic components, often at or near their normal operating temperatures. Heat sinks are used to prevent the temperature of sensitive components from exceeding their rated values, as this can cause excessive wear, damage, and possibly fire hazards. This thermal - heat sink is particularly well suited for smaller products due to its compact size.

Construction

The ATS-07E-204-C2-R0 Thermal - Heat Sink is constructed of copper plates and plates of stamped aluminum. There are fins on each side of the device which are designed to increase the surface area, allowing for greater heat dissipation. The fins also help to trap heat and reduce the amount of heat lost to the environment. The device also contains a fan mounted to one side of the unit, which provides additional air circulation.

Working Principle

The working principle behind the ATS-07E-204-C2- R0 Thermal - Heat Sink is the process of heat transfer. Heat is transferred from the source of the heat, typically a chip, to the sink where it can dissipate into the surrounding environment. The heat is transferred through convection, which is the movement of air from an area of high pressure to an area of low pressure. The fins on the sink\'s surface increase the surface area to maximize heat dissipation. The fan helps to draw air through the fins and increase the speed of the air, allowing more effective heat transfer.

Advantages

The ATS-07E-204-C2-R0 Thermal - Heat Sink provides several advantages over traditional cooling methods. It is much smaller than other cooling solutions, making it easier to install. It is also more efficient, as it is able to transfer more heat from the source than other solutions. It also utilizes the fan to increase air speed and maximize heat transfer, which helps to reduce power consumption. Finally, it has a long life span and requires very little maintenance.

Conclusion

The ATS-07E-204-C2-R0 Thermal - Heat Sink is an effective and efficient thermal cooling solution for a wide variety of electronic devices and components. The design is simple and compact, making it easy to install. Its working principle is based on convection, which transfers heat from the source to the sink. The device also utilizes a fan to increase air speed and further maximize heat transfer. These features make the ATS-07E-204-C2-R0 an ideal choice for cooling electronic components.

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