| Allicdata Part #: | ATS13077-ND |
| Manufacturer Part#: |
ATS-07E-30-C2-R0 |
| Price: | $ 8.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07E-30-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 7.99470 |
| 10 +: | $ 7.54866 |
| 25 +: | $ 7.10465 |
| 50 +: | $ 6.66061 |
| 100 +: | $ 6.21652 |
| 250 +: | $ 5.77249 |
| 500 +: | $ 5.66147 |
| 1000 +: | $ 5.55046 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are a type of device that is used to transfer heat away from any object or surface. Heat sinks are used in a variety of different applications to help manage temperatures. Heat sinks are commonly used in computers, phones, laptops, tablets, and a variety of other electronic devices to regulate the temperatures. They can also be found in refrigeration and air conditioning systems, home appliances, and a variety of industrial applications.
ATS-07E-30-C2-R0 is a type of thermal heat sink designed to help manage temperatures in a variety of applications. It is composed of a black anodized extruded aluminum body and a clip that can be bent to fit the desktop or other surfaces. The air vent plate is also made of aluminum and is designed to disperse heat away from components that are located in the desktops.
The working principle of the ATS-07E-30-C2-R0 is to dissipate heat generated by internal components. This is achieved through a combination of thermal adhesives, thermal linear insulation, and a heat pipe. The thermal adhesive is used to fill in the gaps created by the thermal linear insulation. The heat pipe then takes in the heat and carries it away from the components so that it is not absorbed and stored by them.
The ATS-07E-30-C2-R0 is designed to be used in a variety of applications, such as desktop computers, laptops, and other office electronics. It is also suitable for use in areas where there is either limited space or where components may be located close together. The ATS-07E-30-C2-R0 is also suited for use in gaming systems and multimedia systems which require consistent temperatures in order to operate efficiently.
The ATS-07E-30-C2-R0 is designed to be versatile and easy to install. It can be mounted onto the desktop or other surfaces quickly and easily using the clip and requires minimal maintenance. The ATS-07E-30-C2-R0 is also durable and can withstand a variety of temperatures. It is also designed to be reliable and can withstand extended periods of use without failing.
The ATS-07E-30-C2-R0 is a versatile thermal heat sink that can be used in a variety of applications to help manage temperatures. It is designed to dissipate heat generated by internal components and is capable of withstanding a variety of temperatures. The ATS-07E-30-C2-R0 is easy to install and requires minimal maintenance. It is also reliable and can withstand extended periods of use without failing. As such, it is a great choice for those who are looking for an effective way to manage temperatures in their device.
The specific data is subject to PDF, and the above content is for reference