| Allicdata Part #: | ATS-07E-33-C1-R0-ND |
| Manufacturer Part#: |
ATS-07E-33-C1-R0 |
| Price: | $ 5.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07E-33-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.86990 |
| 30 +: | $ 4.59900 |
| 50 +: | $ 4.32860 |
| 100 +: | $ 4.05802 |
| 250 +: | $ 3.78748 |
| 500 +: | $ 3.51695 |
| 1000 +: | $ 3.44932 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are becoming increasingly important in modern computing and other electronic systems. Heat sinks, which dissipate excess heat from the components they are attached to, are one of the more popular options. The ATS-07E-33-C1-R0 heat sink is one example of this type of thermal management solution.
The ATS-07E-33-C1-R0 is a medium-sized thermal heat sink designed for optimal thermal resistance. It has a surface area of 0.76 square inches, and it is designed to provide efficient cooling by using copper or aluminum fins attached to a base plate. The copper or aluminum fins help to efficiently dissipate the heat generated by the electronic components they are attached to. The base plate contains a thermal interface material (TIM) that works to reduce the thermal resistance between the heat sink and the component, allowing for better heat transfer.
The ATS-07E-33-C1-R0 is commonly used in computing applications, including microprocessors, CPUs, GPUs, and semiconductors. It is also used in a wide variety of other applications, such as automotive, telecommunications, consumer electronics, and medical electronics. The heat sink has been designed to meet the requirements of many different types of electronic components, making it a versatile thermal management solution.
In addition to its usage in various applications, theA TS-07E-33-C1-R0 is also easy to install. It is typically attached to the electronic component using two or four screws. Once the heat sink is installed, it helps to dissipate excess heat from the component, allowing the system to run more efficiently and reliably. Furthermore, the heat sink does not require any maintenance or extra cooling fans, making it a cost-effective solution.
The ATS-07E-33-C1-R0 heat sink is built with high-quality materials, which makes it a reliable and efficient thermal management solution. It is designed to provide optimal performance in a wide variety of applications. Furthermore, its easy installation and low maintenance requirements make it an ideal choice for many types of electronic systems.
The specific data is subject to PDF, and the above content is for reference