ATS-07E-37-C1-R0

Thermal management is an essential aspect in the design of technology based products. Heat generated during operation can result in damage and inefficiencies if not controlled and dissipated. Heat sinks are one of the most common and effective solutions to reduce thermal energy and maintain operation. The ATS-07E-37-C1-R0 is a fanless heat sink assembly for use in high power applications.

The ATS-07E-37-C1-R0 has a size of 37mm x 37mm and is suitable for systems such as CPUs, GPUs, small form factor PCs and other applications requiring dynamic cooling. The sink utilizes a double sided copper-clad construction with a base of 0.45mm and copper fins (maximum thickness 1.2mm) with a total height of 11mm. The thermal resistance of 0.48°C/W makes the sink an effective heat solution in long-term operation.

The ATS-07E-37-C1-R0 is designed for use in high-power applications where efficient and reliable thermal management is required. As the assembly is fanless, the sink offers no vibration or noise interference, allowing for a non-disruptive thermal solution. The sink creates a denser heat transfer environment than fan-based solutions, while still providing dependable cooling performance.

In operation, the double-sided copper design of the ATS-07E-37-C1-R0 allows heat to be transferred away from the processor quickly and efficiently from both sides. The assembly uses copper-clad technology which provides an optimized contact surface for more efficient heat conduction. The copper-clad fins have a large surface area and act as a heatsink, dissipating heat away from the main processor and other components quickly and effectively.

The ATS-07E-37-C1-R0 heat sink assembly is designed for reliable and efficient cooling. Its double-sided copper-clad construction and thermal resistance of 0.48°C/W allows it to efficiently dissipate heat in long-term applications. Its fanless design ensures quiet and non-disruptive operation which is ideal for high-power systems.