| Allicdata Part #: | ATS-07E-37-C3-R0-ND |
| Manufacturer Part#: |
ATS-07E-37-C3-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07E-37-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are used in a variety of applications where efficient thermal management is essential, including niche markets such as healthcare, military and aerospace. One example of a heat sink is the ATS-07E-37-C3-R0. This device is a highly efficient thermoelectric heat sink featuring advanced technology for embedded processors, GPUs, high-performance computers, and high-performance electronic equipment. The device is designed to dissipate heat generated by components in a compact design.
The ATS-07E-37-C3-R0 is specially designed to dissipate heat generated by components inside a closed assembly. It is constructed with a solid base and a heatsink body constructed with high-performance composite materials. This heat sink pairs a cylindrical heat sink with a low profile design to maximize heat conduction. The device features high-efficiency conduction grooves on the surface that increase efficiency and reduce noise.
The ATS-07E-37-C3-R0 is designed to minimize power loss while also providing low thermal resistance and superior thermal management. The device features an advanced thermal design which provides a maximum temperature difference between components and a heat sink of up to 50ºC. The device also has a low temperature gradient and a low thermal impedance.
The ATS-07E-37-C3-R0 is particularly useful in embedded processors, GPUs, high-performance computers, and high-performance electronic equipment due to its high thermal management efficiency and low power loss. The device features a low profile and robust construction that allows it to be mounted easily inside a closed assembly. The device also features a high-efficiency cooling fan that helps to optimize efficiency and reduce noise.
The ATS-07E-37-C3-R0 is designed to provide a reliable and effective solution for thermal management in a variety of applications. The highly efficient thermoelectric heat sink is able to dissipate heat generated by components in a compact design, allowing it to be installed in tight spaces while providing excellent thermal management. The device also features a low profile and robust construction that makes it easy to mount inside a closed assembly. In addition, the device has a high-efficiency cooling fan that helps optimize efficiency and reduce noise.
Thanks to its high thermal management efficiency, low power loss, and robust construction, the ATS-07E-37-C3-R0 can be used in a variety of applications, including healthcare, military and aerospace. The device is designed to provide reliable and effective thermal management in a compact design, allowing it to be used in cramped spaces or where space is at a premium. In addition, the device is designed to be able to handle high levels of heat dissipation, making it suitable for use in high-performance electronic equipment.
The specific data is subject to PDF, and the above content is for reference