| Allicdata Part #: | ATS13085-ND |
| Manufacturer Part#: |
ATS-07E-50-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07E-50-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential for the proper operation of electronic components in applications ranging from consumer electronics and automotive electronics to power systems and medical instruments. Heat sinks are one of the most common solutions used to improve thermal performance and are used for the cooling of components and dissipating heat energy. The ATS-07E-50-C2-R0 is a heat sink designed for use in high-power applications, and this article will explore its applications and working principles.
The ATS-07E-50-C2-R0 is a heat sink designed to efficiently move heat away from high-power components, such as CPUs or GPUs. It features a 50 x 25mm base with a unique fin array for increased thermal performance. The heatsink is also equipped with a 4-pin fan connector and an effective 6mm aluminum extrusion profile for superior heat dissipation. The heatsink is a compact and lightweight design that can be easily mounted on any surface, making it perfect for applications where space is at a premium.
The working principles of the ATS-07E-50-C2-R0 rely on the transfer of thermal energy away from the source and into the environment. Heat is transferred by conduction between the heat source and the heat sink, and by convection between the heat sink and the ambient air. This process is aided by the use of the fan and the aluminum fins which increase the surface area of the heatsink and allow for increased air circulation across its surface.
In terms of applications, the ATS-07E-50-C2-R0 is ideal for cooling CPUs, GPUs, and other components that generate a large amount of heat energy. It is suitable for applications such as gaming laptops, desktop computers, and other electronic devices where thermal management and efficient cooling is essential. It can also be used in automotive and industrial applications where thermal performance is a critical factor.
The ATS-07E-50-C2-R0 is a highly versatile heat sink that is designed to provide superior thermal performance in a range of applications. Its unique fin array, fan connector, and aluminum extrusion profile allow it to effectively dissipate thermal energy while being compact and lightweight. It is a great choice for cooling CPUs, GPUs, and other high-power components where reliable thermal management is essential.
The specific data is subject to PDF, and the above content is for reference