ATS-07E-63-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.32°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Application Field and Working Principle of ATS-07E-63-C2-R0 Thermal - Heat Sink

Thermal - Heat Sinks are electromechanical components designed to provide passive cooling for the electronic devices. They allow for the heat generated in the circuitry to be dissipated efficiently in order to maintain the critical components within the safe temperature levels and avoid overheating. One of such components is the ATS-07E-63-C2-R0 Thermal - Heat Sink.This components comes with an aluminum extrusion body and polyamide clip, offering a simple and compact form of thermal management. It utilizes a Heatpipe® technology and has an integrated fan for more efficient waste heat dissipation. The combination of aluminum extrusion body and Heatpipe® technology offers an effective cooling with cover 95% of the total surface area. It is designed to be compact, thus the ATS-07E-63-C2-R0 Thermal - Heat Sink has a small footprint and can be integrated into a wide array of applications.The ATS-07E-63-C2-R0 Thermal - Heat Sink is ideal for any application that requires efficient waste heat dissipation and high power components. It is suitable for high-performance processors, graphic cards as well as motherboards, server racks and data centers. The compact size makes it a great option to install into tight spaces without compromising its effectiveness.In terms of working principle, when a conductor comes into contact with a heated device, like a processor, it begins to absorb the heat from the device and dissipate it as thermal energy into the environment. The Aluminum extrusion body on the ATS-07E-63-C2-R0 Thermal - Heat Sink works as a passive cooling element, allowing for the internal components to be cooled down efficiently, while the fan inside ensures that the heat energy is dissipated correctly. In addition, the integrated Heatpipe® technology circulates the heat through its metallic walls, allowing for a more uniform and efficient cooling.The ATS-07E-63-C2-R0 Thermal - Heat Sink is designed for long-term reliability and thermal performance. It features a driven electronic fan to spin faster and slower depending on the heat produced by the device. With a high-efficiency and an anti-vibration design, the ATS-07E-63-C2-R0 Thermal - Heat Sink allows for a smooth and quiet operation. The metal housing dissipates heat effectively and ensures longer component life, while the optional mounting hardware allows for an easy installation process.Overall, the ATS-07E-63-C2-R0 Thermal - Heat Sink is an efficient and effective cooling solution for any device. It is an ideal choice for applications that require a reliable thermal performance and an efficient waste heat dissipation. Thanks to its compact size and its Heatpipe® technology, it works perfectly for high-performance processors, graphic cards as well as motherboards, server racks and data centers. Its metal housing dissipates the heat effectively and ensures a longer component life. The incorporated anti-vibration design reduces the noise, allowing for a smooth and quiet operation. With its integrated fan and optional mounting hardware, the ATS-07E-63-C2-R0 Thermal - Heat Sink is an ideal solution for managing temperatures within the device.

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