ATS-07F-103-C1-R1 Allicdata Electronics
Allicdata Part #:

ATS-07F-103-C1-R1-ND

Manufacturer Part#:

ATS-07F-103-C1-R1

Price: $ 4.31
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X9.5MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07F-103-C1-R1 datasheetATS-07F-103-C1-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 3.87513
30 +: $ 3.65967
50 +: $ 3.44434
100 +: $ 3.22906
250 +: $ 3.01379
500 +: $ 2.79852
1000 +: $ 2.74471
Stock 1000Can Ship Immediately
$ 4.31
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 27.64°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are the most common way of controlling temperature and protecting electronic components from heat damage. Thermal - Heat Sinks have become ubiquitous in all types of electronics, from consumer applications to industrial machinery. One of the most popular Thermal - Heat Sinks is the ATS-07F-103-C1-R1.

The ATS-07F-103-C1-R1 is a highly efficient thermal-heat sink designed with the utmost precision. This heat sink features a self-contained cooling system, which ensures an optimized temperature range. Its low profile design is perfect for applications where space is limited. The ATS-07F-103-C1-R1 frees up valuable PCB real estate, making it ideal for use in a variety of applications.

The ATS-07F-103-C1-R1 is designed to efficiently handle thermal loads ranging from -45°C to +125°C. The unique fin design improves the cooling performance and overall surface area (by +20%) which increases thermal dissipation. This is done through a mixed-flow fan design which optimizes the air-flow and maximizes the cooling efficiency. The ATS-07F-103-C1-R1 is also compliant with RoHS standards.

The ATS-07F-103-C1-R1 is suitable for a variety of applications, including power transistors, small cluster racks, high-speed CPUs, GPUs, memory chips, embedded systems, security systems, and more. By utilizing the ATS-07F-103-C1-R1, these applications can be protected from heat damage and can operate at peak performance. The optimized temperature range also ensures maximum longevity.

The ATS-07F-103-C1-R1 achieves optimal dissipation of heat by utilizing two key aspects of heat transfer - conduction and convection. The ATS-07F-103-C1-R1 utilizes conduction to transfer heat from the component to the thermal-heat sink. The heat then travels through the thermal-heat sink fins and is lowered through convection as the air inside the fin flows around and absorbs the heat. This air is then drawn away by the fan, ensuring the cooling of the system.

The ATS-07F-103-C1-R1 also features an adjustable air-flow rate which can be fine-tuned for a variety of different applications. This allows for different levels of cooling depending on the requirement. This feature further enhances the ability of the ATS-07F-103-C1-R1 to dissipate heat in all types of devices.

In summary, the ATS-07F-103-C1-R1 is an ideal Thermal - Heat Sink for a variety of applications. It offers excellent performance, reliability, and thermal protection. By utilizing a combination of conduction and convection, as well as adjustable fan speed, the ATS-07F-103-C1-R1 is able to deliver maximum heat transfer and cooling efficiency. Its low profile design makes it the perfect choice for space-limited applications. As a result, it has become one of the most popular thermal-heat sinks for a variety of different applications.

The specific data is subject to PDF, and the above content is for reference

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