| Allicdata Part #: | ATS-07F-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-07F-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are important components of modern-day electronics and are used to dissipate heat effectively. With advancements in technology, improved thermal-management components are now available that provide better performance, lower cost, and higher reliability. The ATS-07F-117-C1-R0 is one such product in the thermal-management category. It is a rugged thermal management solution for harsh operating environment applications such as control circuitry in oil and gas, harsh industrial, telecom, and military markets.
The ATS-07F-117-C1-R0 is a highly efficient passive heat sink solution designed to meet the needs of busy and challenging application fields. It is capable of dissipating heat from densely packed components such as processors, ASICs, memory, and other integrated circuits. The design of this product enables a very small form factor, yet highly efficient thermal dissipation.
The ATS-07F-117-C1-R0 uses a cold corner concept. This design uses an efficient finned housing that cools the components in an active manner. The fins capture the heat and dissipate it through the fins to the environment. This design is highly efficient in that it is able to dissipate a large amount of heat from the device, and is able to keep the components cool even during peak times. The fins are designed in such a way as to allow air to flow through them, allowing natural convection to take place. This allows the fins to be effectively cooled by the surrounding air.
The ATS-07F-117-C1-R0 is ideal for challenging applications due to its unique combination of design characteristics. It is compact, lightweight, and rugged. It is also very effective in dissipating large amounts of heat. In addition, the design of the fins allows for natural convection, making it even more effective in cooling components.
The ATS-07F-117-C1-R0 is a cost-effective solution to cooling components. It is also well-suited to a wide variety of applications such as industrial controllers, telecom systems, medical equipment, and military applications. The ATS-07F-117-C1-R0 is a reliable, lightweight and rugged thermal solution for demanding applications.
The specific data is subject to PDF, and the above content is for reference