| Allicdata Part #: | ATS-07F-128-C3-R0-ND |
| Manufacturer Part#: |
ATS-07F-128-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-128-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical to ensuring safe, optimal performance of a number of electrical and electronic devices. Overheating can lead to poor performance and even catastrophic failure in extreme cases. Thermal management systems are designed to regulate the temperature of critical components by dissipating the heat generated during operation. Heat sinks are a key component of many thermal management systems. The ATS-07F-128-C3-R0 is a type of heat sink designed for various applications.
The ATS-07F-128-C3-R0 heat sink is a single-piece aluminum extrusion with an open-ended design. It is designed for maximum air flow and heat dissipation. The extrusion has a straight-fin profile for increased surface area and also features multiple mounting holes and slots. This makes it ideal for a wide variety of applications, such as fan-less cooling systems, or even for attaching heatsinks to other components.
The ATS-07F-128-C3-R0 has a number of unique features that make it particularly well suited for certain applications. One of the most notable is its optimized fin profile, which is designed to maximize air flow and heat transfer. This feature makes it well suited for use in cooling high power electronic components, such as CPUs and GPUs. It also has an anodized finish, which eliminates any oxidation issues and allows for maximum efficiency. Finally, the heat sink includes a dovetail mounting system, which allows for secure mounting of the unit onto a flat surface.
Its working principle is fairly straightforward and relies on three main processes: convection, conduction, and radiation. Convection occurs when warmer air rises from the heat sink fins and is replaced with cooler air. This reduces the amount of heat being generated by the device. Conduction occurs when heat is transferred from one surface, such as a device, directly to another surface, such as an aluminum heat sink. Radiation is the transfer of energy through space, where heat is absorbed by nearby objects. Combined, these processes dissipate the heat produced by the device to the surrounding environment.
The ATS-07F-128-C3-R0 heat sink is an ideal choice for a wide variety of applications that require thermal management. Its optimized fin profile and dovetail mounting system make it an excellent choice for cooling high power components. Its anodized finish ensures optimal heat transfer and prevents oxidation issues. With its wide range of features and versatile design, the ATS-07F-128-C3-R0 is a great choice for any thermal management needs.
The specific data is subject to PDF, and the above content is for reference