| Allicdata Part #: | ATS-07F-140-C3-R0-ND |
| Manufacturer Part#: |
ATS-07F-140-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-140-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical factor in the proper functioning of many electronics, and the ATS-07F-140-C3-R0 Heat Sink is designed to address a wide range of needs. This device is a thermal interface solution for power semiconductors and small surface mount components. The ATS-07F-140-C3-R0 Heat Sink utilizes a fastening system which allows for simplified installation and superior thermal performance compared to traditional solutions. This makes it an ideal solution for applications where space is limited.
The ATS-07F-140-C3-R0 heat sink is comprised of a steel frame with two chiseled fins. The fins are designed to effectively dissipate heat from the base plate by directing air flow across the base plate. This design encourages efficient thermal transfer by minimising the distance between the base and the fins. With this design, the ATS-07F-140-C3-R0 Heat Sink maximizes the thermal conductivity between source and sink.
Thermal management is important for any electronic device, and the ATS-07F-140-C3-R0 Heat Sink is designed to reduce the overall temperature, increasing the lifespan of any device. The ATS-07F-140-C3-R0 Heat Sink is capable of dissipating up to 140W of heat at 50 °C, meaning that it can be used for powerful applications. This makes it well suited for intensive applications such as high-end electronics and industrial computers where efficient cooling is critical.
In terms of installation, the ATS-07F-140-C3-R0 Heat Sink is relatively easy to install. It is designed with a fastening system which allows it to be quickly and securely attached to the cooling surface. Additionally, the device is designed to be compatible with multiple types of heat transfer systems, including air, liquid, and hybrid. This makes the ATS-07F-140-C3-R0 Heat Sink a versatile solution for a variety of cooling applications.
The ATS-07F-140-C3-R0 Heat Sink is designed to excel in a range of thermal management applications. It is an ideal solution for high-performance devices, making it well suited for industrial computers and other intensive electronic applications. Additionally, its fastening system and compatibility with multiple heat transfer systems makes it a hassle-free solution for any application. With its superior cooling performance and simple installation, the ATS-07F-140-C3-R0 Heat Sink is an ideal solution for any Thermal Management application.
The specific data is subject to PDF, and the above content is for reference