| Allicdata Part #: | ATS-07F-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-07F-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential part of successful component designs in most electronic applications, and heat sinks are an effective equipment that help dissipate the generated heat. ATS-07F-153-C1-R0 is one type of heat sink components that is specifically designed for thermal applications in the 17-32V power conditioning sector. This component is designed to cut thermal losses and maximize performance for its intended use.
The ATS-07F-153-C1-R0 has a well-structured copper tube with a highly resistant heat dissipation layer. The layer inside the tube increases the thermal impedance, which helps improve the efficiency of heat transfer from the component to its heat sink. The finned heat sink also extends the conducitivity to the surrounding environment to dissipate the energy more efficiently. The fin design ensures that the air circulation helps in dissipating the heat more effectively. Finally, the exterior casing of the component is designed to protect the component from environmental elements.
This thermal component also features a passive dynamic control system which has been optimized to improve system performance. The control system features six programs that include monitoring and control options for different parameters like thermal profile, voltage, input current, and other features. The component is also equipped with a built-in temperature sensing circuit which can monitor the temperature of the device and determine how much power needs to be used.
The ATS-07F-153-C1-R0 is designed for high efficiency, high reliability, and long service life. It is a proven technology, and has been used in various industries for years now. The device is compatible with various environmental conditions, and can withstand a wide range of temperatures and humidity levels. In addition, it is designed to significantly reduce the amount of time it takes to reach temperatures that are necessary for optimal operation.
The ATS-07F-153-C1-R0 can be applied in many different situations, but its primary application lies in 18-32V power conditioning. The device is designed to increase the efficiency of power circuitry and reduce thermal losses due to the heat generated. The passive dynamic control system also ensures optimal performance over different temperature ranges. The device is thus essential for applications where efficient power conditioning is required.
In conclusion, the ATS-07F-153-C1-R0 is a thermal component specifically designed for 17-32V power conditioning applications. It features a well-structured copper tube and a highly resistant heat dissipation layer, as well as a passive dynamic control system which can monitor and control several parameters. The finned heat sink ensures good air circulation and efficient heat dissipation, and the exterior casing of the component protects it from environmental elements. This component is highly efficient, reliable and long-lasting, and is essential for efficient power conditioning.
The specific data is subject to PDF, and the above content is for reference