| Allicdata Part #: | ATS13210-ND |
| Manufacturer Part#: |
ATS-07F-16-C2-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-16-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.05090 |
| 10 +: | $ 3.94443 |
| 25 +: | $ 3.72506 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sink products are used in a variety of industrial and commercial applications, ranging from computer processors to automotive cooling systems. The ATS-07F-16-C2-R0 is one such heat sink product, and is designed for improved thermal performance in high-power, very complex microprocessor applications. This article will provide an overview of the ATS-07F-16-C2-R0 application field and working principle.
The ATS-07F-16-C2-R0 is a compact, low profile, high performance device designed to improve heat dissipation in applications needing directions to exhaust the waste heat. This heat sink is designed to be very efficient and will provide cooling for processors, FPGAs, digital signal processors, ASICs, and any other component utilizing external heat sink assemblies. The ATS-07F-16-C2-R0 heat sink is constructed of aluminum with a unique fan blade design offering maximum noise levels while providing superior cooling performance.
The ATS-07F-16-C2-R0 heat sink is designed to attach directly onto the surface of the part it is cooling. This ensures that the thermal pad is pressed firmly against the component, thus providing ideal thermal contact. This design also helps to eliminate any thermal gaps between the heat sink and the component, resulting in improved thermal performance. The heat sink is also designed to provide fast and efficient cooling for the component, allowing for improved power density, increased efficiency, and less energy consumed.
The ATS-07F-16-C2-R0 heat sink features a stepped shape which allows for more evenly distributed pressure and air convection. This design provides a larger surface area in contact with the component, allowing for improved heat transfer performance. This stepped design also helps to reduce turbulence within the heat sink which can lead to a decrease in noise levels. The fan inclusions also feature a shroud to optimize air flow in order to maximize cooling performance.
The ATS-07F-16-C2-R0 also utilizes fans that are designed for high airflow and low power consumption. These fans also feature specialized blades which generate less noise while providing better cooling performance. The fan blades also have a unique shape which creates greater pressure, thus providing improved air flow. The fan is also designed to be extremely reliable and will protect against dust and other particles entering the system, thus ensuring reliable and consistent performance.
The ATS-07F-16-C2-R0 heat sink is designed to provide superior thermal performance in high-power, very complex microprocessor applications. This design allows for more evenly distributed pressure and air convection, resulting in improved heat transfer performance. The unique fan blade design also provides improved airflow and improved noise levels. The fan is designed for high airflow and low power consumption, allowing for increased efficiency and reduced energy consumption. This heat sink is designed to attach directly onto the surface of the part it is cooling and also features a stepped shape for more evenly distributed pressure and air convection. All of these design features combine to create an efficient, reliable, and high-performance thermal heat sink solution.
The specific data is subject to PDF, and the above content is for reference