| Allicdata Part #: | ATS-07F-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-07F-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-07F-173-C1-R0 is a heat sink product manufactured by Advanced Thermal Solutions. It is a highly efficient cooling product designed for use in various applications. It is made up of an aluminum fins and an extruded aluminum base that provides optimal heat transfer. Additionally, this thermal product has a high thermal resistance, making it ideal for use in a wide variety of thermal applications.
ATS-07F-173-C1-R0 is designed to provide efficient thermally conductive cooling to a wide variety of electronics products and components. It functions by transferring heat away from a component by means of conduction, convection, or radiation and dissipating it away from the heat source. Heat is transferred from the component to the heat sink where it is conducted away from the component through the aluminum fins. The heat is then dissipated by convection currents moving away from the heat sink. The aluminum fins and base act as both a heatsink and a passive heat spreader, further enhancing the efficiency of the thermal cooling process.
The thermal properties of ATS-07F-173-C1-R0 provide it with wide applications in many industries. Its low thermal resistance and efficient heat dissipation make it ideal for use in cooling and protecting electronic components that require high performance cooling but also require a small footprint. Such components include electronic packaging, power supplies, power electronics, or any other thermal sensitive component. Additionally, this thermal product is well suited for use in control circuits, audio amplifiers, and other high performance audio equipment as well as in residential and commercial HVAC systems.
ATS-07F-173-C1-R0 can also be used in automotive applications such as engine cooling and power electronics due to its efficient thermal management. Additionally, this heat sink is ideal for high-temperature applications such as semiconductor processing and aerospace applications requiring high thermal conductivity. Finally, this thermal product can be used to prevent overheating of critical components such as sensors and motor controllers in robotics applications.
In summary, ATS-07F-173-C1-R0 is a high efficiency thermal product empowered by its aluminum fins and base. This thermal product provides enhanced thermal conductivity and cooling capabilities. It is well suited for use in a variety of electronics components, control circuits, audio amplifiers, and HVAC systems as well as automotive, semiconductor processing, and aerospace applications. Despite its small size, it has proven itself to be an effective solution for thermal management in a variety of applications.
The specific data is subject to PDF, and the above content is for reference