| Allicdata Part #: | ATS-07F-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-07F-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electrical components is of critical importance to a variety of industries. Heat accumulation can cause components to become damaged or fail completely, resulting in costly and dangerous consequences. To prevent this from happening, solutions such as heat sinks are often used to radiate away excess heat and reduce the risk of catastrophic failure. ATS-07F-20-C1-R0 is one such engineering solution that is used in a variety of applications.
The ATS-07F-20-C1-R0 is a finned, aluminum-based heat sink designed for the purpose of dissipating heat generated from electrical components. It features a closed loop fin design that maximizes the surface area through which heat can be dissipated. The aluminum base is mated to a black anodized finish for improved corrosion resistance. The unit is designed to be mounted on a PCB using a variety of different brackets, depending on the application. The device is also compliant with the Keyelco Low Profile mounted hardware series, meaning that it can be used in applications that require a low profile installation.
The ATS-07F-20-C1-R0 is commonly used in applications that require thermal management of small components, such as portable electronics. The heat sink is able to dissipate excess heat away from the components, ensuring that they do not become damaged or fail. The device is also compatible with a variety of mounting options. This allows for flexibility in design and makes it suitable for a wide range of applications.
The working principle of the ATS-07F-20-C1-R0 is relatively straightforward. Heat is generated by the components and conducted into the aluminum base. The heat is then dissipated into the surrounding environment through finned extrusions. The fin design maximizes the contact area between the aluminum base and the environment, allowing for increased heat dissipation efficiency. The anodized black finish coating also enhances corrosion resistance and improves the aesthetic appeal of the device.
The ATS-07F-20-C1-R0 is a highly effective heat sink due to its closed loop fin design. This design maximizes the surface area available for heat dissipation, resulting in improved thermal management performance and reduced risk of component damage. Additionally, its compatibility with standard mounting solutions gives users the ability to incorporate the heat sink into their design with relative ease. As such, the ATS-07F-20-C1-R0 is a popular choice for applications requiring efficient thermal management of small components.
The specific data is subject to PDF, and the above content is for reference