| Allicdata Part #: | ATS-07F-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-07F-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are most commonly used to reduce the risk of overheating due to excessive power consumption or high temperatures. The application fields and working principle of the ATS-07F-20-C3-R0 Thermal heat sink are as follows.
Application Fields of the ATS-07F-20-C3-R0 Thermal Heat Sink
The ATS-07F-20-C3-R0 Thermal Heat Sink is ideal for use in applications where low thermal resistance and high performance cooling are required. The device is capable of dissipating heat generated by components such as CPUs, FPGAs, and GPUs, as well as storing heat generated by LEDs, AC/DC drives and power supplies.
The ATS-07F-20-C3-R0 Thermal heat sink is ideal for use in electronics, mechanical and automotive applications. The device is suitable for fanless operation and offers a wide variety of mounting options, including through-hole, surface-mount, and clip-mount. The device is also available in different sizes, making it suitable for a variety of applications.
The ATS-07F-20-C3-R0 Thermal Heat Sink is also suited for medical applications, such as medical imaging, and high-temperature test systems. The device has a modular structure, which enables easy assembly and installation in a wide variety of thermally demanding environments.
Working Principle of the ATS-07F-20-C3-R0 Thermal Heat Sink
The ATS-07F-20-C3-R0 Thermal Heat Sink works by drawing in ambient air and using it to dissipate the heat generated from the components it is attached to. The device uses a combination of convection, conduction, and radiation to dissipate the heat, thus keeping the components at an optimum temperature. The heat sink also has a large number of fins that increase its surface area, allowing more air to be drawn in, thus enabling even better heat dissipation.
The ATS-07F-20-C3-R0 Thermal Heat Sink also has air channels which allow air to pass through the device. This enables the air to flow through the fins evenly, thus promoting better heat exchange. Furthermore, the heat sink has an internal heat shield that acts as a barrier to keep out dust and debris.
The ATS-07F-20-C3-R0 Thermal Heat Sink also has a number of additional features such as vibration-dampening rubber feet, fan mounting holes, and countersunk screws which further enhance the performance and durability of the device.
Conclusion
The ATS-07F-20-C3-R0 Thermal Heat Sink is an ideal device for use in a variety of electronics, medical, and automotive applications. The device is capable of dissipating heat efficiently and has a number of features such as air channels, an internal heat shield, vibration-dampening rubber feet, and fan mounting holes that make it an efficient and reliable heat sink device. The device is available in different sizes, making it suitable for a variety of applications.
The specific data is subject to PDF, and the above content is for reference