| Allicdata Part #: | ATS-07F-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-07F-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Management is a key element in any system design. Heat needs to be efficiently conducted away from the components to prevent overheating, avoid performance degradation, and ensure reliable operation. ATS-07F-200-C3-R0 is a component that takes on this important role in many applications by efficiently transferring heat away from its source.
The ATS-07F-200-C3-R0 is a specialized heat sink that provides cooling solutions for CPUs, GPUs, and other heat-generating parts in computing and telecom applications. The device utilizes a unique design that combines convection cooling with a combination of free convection and heat pipes, allowing the device to bring heat away from the intended source quickly and accurately.
The ATS-07F-200-C3-R0 features a durable aluminum and all-metal construction, with an optimized fin design and structure to ensure maximum heat dissipation. The device is also designed with metal material fin bond to provide excellent heat conduction, while the heat pipes enable a quick and uniform transfer of heat away from the source.
The ATS-07F-200-C3-R0 uses a range of technologies to maximize the heat transfer rate. The device features a patented heat-pipe structure that uses vapor chamber technology to quickly bring heat away from the source component. This technology also helps to ensure uniform heat transfer across the heat-pipe surface.
Another feature of the ATS-07F-200-C3-R0 is its high thermal conductivity. This helps to ensure fast and efficient transfer of heat from the component to the fins for release into the ambient air. The device also features the ability to work with a higher thermal loading, meaning it is able to dissipate more heat without compromising its efficiency or reliability.
Finally, the ATS-07F-200-C3-R0 is highly configurable and can easily be adapted to different applications. The device supports both top and side mounting, and can be easily clipped or adjusted for different mounting orientations. Additionally, the device also features adjustable fan speed, allowing users to tailor the cooling performance to their specific application.
In conclusion, the ATS-07F-200-C3-R0 is designed to be an efficient and reliable thermal management solution for any application. Its combination of heat-pipe technology and metal construction enables rapid and uniform transfer of heat away from the component. Its adjustable fan speed and configurability allow users to easily adapt the heat sink for any specific application, while its high thermal conductivity ensures efficient and reliable transfer of heat to the ambient air.
The specific data is subject to PDF, and the above content is for reference