ATS-07F-27-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS13272-ND

Manufacturer Part#:

ATS-07F-27-C2-R0

Price: $ 7.71
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07F-27-C2-R0 datasheetATS-07F-27-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.94260
10 +: $ 6.75486
25 +: $ 6.37963
50 +: $ 6.00440
100 +: $ 5.62918
250 +: $ 5.25390
500 +: $ 4.87862
1000 +: $ 4.78480
Stock 1000Can Ship Immediately
$ 7.71
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.24°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are a critical component of a successful product. The ATS-07F-27-C2-R0 thermal heat sink is a high efficiency, energy saving solution for controlling the temperature of a wide variety of devices. The heat sink is constructed from extruded aluminum and features an enamel black/silver finish. Its profile is slim and stylish, making it a great fit for any consumer product.

The ATS-07F-27-C2-R0 features a ‘direct surface contact’ design, providing superior heat transfer capability. The thermal mass of the aluminum allows for fast heat absorption and better distribution throughout the chassis. The heat sink’s bottom surface is exposed to the air, which quickly dissipates the heat and ensures high cooling performance. The unique feature of the ATS-07F-27-C2-R0 heat sink is that the bottom surface can be modified to perfectly match the size and shape of the device requiring cooling.

Using the ATS-07F-27-C2-R0 as a cooling component is relatively straightforward. The device should be mounted atop the component or device that needs to be cooled. The heat sink should be firmly held down, in order to ensure efficient transfer of heat. A thermal paste or pad should be applied on the contact point. Once everything is secured, the heat sink can begin absorbing and dissipating heat.

Apart from its cooling function, the ATS-07F-27-C2-R0 also offers a number of other features. The unique shape of the heat sink provides a visual and tactile experience for the user. Its low profile allows it to be installed in even the tightest of spaces. The heat sink also resists corrosion and its surface remains cool to the touch, even after long hours of use.

The ATS-07F-27-C2-R0 is an ideal solution for anyone looking for a reliable and energy efficient thermal management solution. Its sleek design makes it a perfect fit for any consumer product, while its superior heat transfer capability ensures a safe and effective cooling experience. With its exceptional performance and stylish profile, the ATS-07F-27-C2-R0 heat sink is an ideal choice for any project requiring thermal control.

The specific data is subject to PDF, and the above content is for reference

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