| Allicdata Part #: | ATS-07F-45-C1-R0-ND |
| Manufacturer Part#: |
ATS-07F-45-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-45-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a critical component of modern electronics. They provide thermal management of various electronic components, and are a vital part of any modern high-tech system. The ATS-07F-45-C1-R0 heat sink is an example of how these components can be integrated seamlessly into an existing system. It is particularly well suited for projects that require a larger heat sink in order to maximize cooling.
The ATS-07F-45-C1-R0 is a thermal solution used to better manage the thermal characteristics of a wide range of electronics components. It has a large, 45 mm surface area with an integrated fan that is capable of dissipating up to 3.8 W of thermal energy. This large surface area provides an immense amount of thermal management capabilities, making it ideal for situations where cooling needs to be maximized.
The ATS-07F-45-C1-R0 is especially suitable when installed in an electronics enclosure. The included mounting hardware makes it easy to install and maintain. Furthermore, it is designed with an integrated adjustable fan that can be adjusted to meet the needs of the specific application.
The working principle of the ATS-07F-45-C1-R0 is to disperse thermal energy away from sensitive components. When the heat sink is placed in an electronics enclosure, its fan pulls in cooler air from outside the unit and blows it over the heatsink surface. This air generates a cooling effect on the component’s surface and transfers thermal energy away from the component.
In addition, the ATS-07F-45-C1-R0 is well-suited for use in various applications. It is well suited for high-power applications such as power supplies, as well as for projects that require a large heat sink to maximize cooling. In addition, it is often used in industrial applications for which high temperatures are expected.
Heat sinks are a vital part of many high-tech systems. The ATS-07F-45-C1-R0 is a great example of how thermal solutions can be integrated into existing electronics applications. It’s large surface area and integrated fan make it well suited for power-hungry components and industrial applications that require maximum cooling.
The specific data is subject to PDF, and the above content is for reference