Allicdata Part #: | ATS-07F-52-C1-R0-ND |
Manufacturer Part#: |
ATS-07F-52-C1-R0 |
Price: | $ 3.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X25MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-07F-52-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.10275 |
30 +: | $ 3.01896 |
50 +: | $ 2.85125 |
100 +: | $ 2.68349 |
250 +: | $ 2.51579 |
500 +: | $ 2.43193 |
1000 +: | $ 2.18034 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.74°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-07F-52-C1-R0 is a part of the Thermal - Heat Sinks family of products. This type of heat sink is used to conduct heat away from components that generate a lot of heat. They are designed to be mounted directly onto components or circuit boards to dissipate heat generated by these components. This type of heat sink is typically used when operating temperatures are higher than the heat dissipation capabilities of the components or circuit boards themselves.
The ATS-07F-52-C1-R0 is a highly efficient heat sink that features an 80 base plate in addition to four vertical fins. The base plate provides a large surface area for heat dissipation while the vertical fins provide a larger area for natural convection. The fin design also increases the surface area of the heat sink, increasing its efficiency.
The ATS-07F-52-C1-R0 works in a number of different ways. First, it increases the surface area of the heat sink to facilitate heat dissipation. Second, the vertical fins create convection currents that flow up through the fins, releasing the heat from the base plate. Finally, the 80 base plate is designed to absorb and transfer thermal energy more efficiently than conventional heat sinks.
The ATS-07F-52-C1-R0 is ideal for applications such as power supplies, computers, medical/industrial equipment, LED lighting, and more. This heat sink\'s ability to dissipate heat more efficiently makes it ideal for applications subjected to high temperatures and power demands. Additionally, this heat sink\'s size and light weight makes it easy to mount and install.
Overall, the ATS-07F-52-C1-R0 is an efficient heat sink that is designed to dissipate heat from components and circuits that generate large amounts of heat. Its 80 base plate and vertical fin design provides increased surface area for increased heat dissipation. This heat sink is perfect for applications subjected to high temperatures and demands, and its size and weight makes it easy to install.
The specific data is subject to PDF, and the above content is for reference