| Allicdata Part #: | ATS-07F-60-C3-R0-ND |
| Manufacturer Part#: |
ATS-07F-60-C3-R0 |
| Price: | $ 4.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-60-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.95577 |
| 30 +: | $ 3.73611 |
| 50 +: | $ 3.51628 |
| 100 +: | $ 3.29654 |
| 250 +: | $ 3.07677 |
| 500 +: | $ 2.85700 |
| 1000 +: | $ 2.80206 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-07F-60-C3-R0 is a highly advanced thermal management solution for modern electronics and other related applications. The product offers an efficient cooling system in a very small package, providing enhanced performance in the applications for which it was intended. The device is designed with the latest technology in mind, offering superior capabilities in terms of heat dissipation and power reduction.
The ATS-07F-60-C3-R0 is a heat sink, a device which is used for the dissipation of heat away from components that produce it. It is usually used in electronics such as processors, graphics cards, high-end servers and other components that generate large amounts of heat. The device transfers thermal energy from those components into the air, allowing for a cooler operating environment.
Heat sinks work by providing a highly conductive surface to allow heat to transfer more quickly from the component. This surface is usually composed of some type of metal, typically aluminum, which has a high thermal conductivity. Additionally, it is frequently coated with a material such as nickel or chrome to further increase its effectiveness. The metal heat sink is designed to provide the largest exposed area for the component to disperse its heat.
The ATS-07F-60-C3-R0 device is a hybrid between an active and passive heat sink. It includes both a fan and a metal base, and as such offers the performance characteristics of both. The fan is typically used to increase the convection of heat away from the component and expel it into the external environment. The metal base is designed to increase the conductivity of the device, further improving thermal efficiency.
Aside from the obvious cooling benefits, the device also provides several secondary advantages. It can significantly extend the life of the component by preventing it from becoming overheated, and it can also reduce the noise produced by fan-cooled components. Additionally, the device is highly effective in avoiding thermal damage to other nearby components due to its cooling ability.
The ATS-07F-60-C3-R0 is an excellent addition to any system where efficient cooling is necessary to maintain stability and performance. It has a number of unique features that make it a great choice for many applications, and it can be easily integrated into existing systems with minimal effort. As a result, it has become a popular thermal management solution for industry professionals.
The specific data is subject to PDF, and the above content is for reference