ATS-07F-63-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat SinksHeat sinks are thermally-conductive components designed to transfer heat away from sensitive electronic components. Heat sinks are made from a variety of materials, including aluminum, copper, and plastic. With advances in the development of composite materials for high-heat applications, many of these new materials have become popular choices in thermal management and heat dissipation. The ATS-07F-63-C3-R0 is a heat sink specifically designed to meet the thermal management needs of a variety of different applications.The ATS-07F-63-C3-R0 is a high-performance heat sink with optimized cooling performance and excellent thermal conductivity. It is constructed from finned aluminum and designed to dissipate heat from a large area. The heat sink is compatible with most single element and two element components, including chips, microprocessors, resistors, FETs, IGBTs, and ICs. With an effective surface area of 802 square centimeters, the ATS-07F-63-C3-R0 is capable of dissipating up to 270 watts of heat at an ambient temperature of 40℃. This makes it an ideal choice for applications which require a high level of thermal management.The ATS-07F-63-C3-R0 offers a number of unique features which make it well-suited for various applications. Firstly, it is designed with unique finned-structure technology which reduces air resistance and increases the overall cooling performance. Secondly, it features a two-piece construction which offers superior thermal dissipation, and is designed to be installed quickly and easily. Lastly, the ATS-07F-63-C3-R0 offers a variety of customization options, such as anodizing and flat punching, as well as an optional paint process.In addition to its high-performance thermal management capabilities, the ATS-07F-63-C3-R0 also offers a wide range of applications. These include a variety of domestic and industrial appliances, consumer electronic devices, medical devices, server motherboards, and telecommunications equipment. With its excellent heat dissipation capabilities and customizability, the ATS-07F-63-C3-R0 is the ideal choice for a variety of applications which require reliable and efficient thermal management.The ATS-07F-63-C3-R0 heat sink is designed with a simple but effective working principle. The fins allow for efficient heat dissipation by increasing the surface area in contact with the surrounding air. As the air around the heat sink is heated, the air rises in price, resulting in a convection current. This convection current transfers the heat rapidly away from the heat source, thus cooling the component and dissipating the heat.In conclusion, the ATS-07F-63-C3-R0 is an ideal choice for a variety of applications which require superior thermal management. Its unique features, including its finned-structure technology, two-piece construction, and customization options, make it incredibly efficient and reliable. It is designed to rapidly dissipate heat away from sensitive components, thus ensuring the longevity and performance of the system. With its wide range of applications, the ATS-07F-63-C3-R0 is the perfect choice for any thermal management solution.

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