| Allicdata Part #: | ATS-07F-65-C1-R0-ND |
| Manufacturer Part#: |
ATS-07F-65-C1-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-65-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks are a device that is designed to keep an electric or electronic component or device from getting too hot. ATS-07F-65-C1-R0 application field and working principle is one of many thermal- heat sink designs that are on the market today. Understanding how these devices work and what they are used for helps to determine the right design for a given application.
The ATS-07F-65-C1-R0 is a type of heat sink designed for high power applications. It is made of aluminum alloy and is designed for mounting to an enclosure where it disperses the heat created by high power devices. The heat sinks have fins to increase the surface area and can be fitted with fans for increased cooling. The aluminum alloy used allows the sink to dissipate the heat quickly, allowing for maximum cooling and efficiency.
The working principle of the ATS-07F-65-C1-R0 Heat Sink is relatively simple. It is made of a material, typically aluminum, that is good at dissipating heat. The sink is then mounted to a mounting surface and connected to the power device it is cooling. Once connected, the heat of the device is transferred to the sink and dissipated into the air. The fins on the sink help to increase the surface area of the sink, allowing for more efficient heat transfer and dispersal.
The application of the ATS-07F-65-C1-R0 Heat Sink varies depending on the specific power device that it is cooling. Generally, this type of heat sink is used in high power applications where the power device can dissipate a large amount of heat. It is a good choice for applications such as computers, servers, power amplifiers, and other high power devices.
The ATS-07F-65-C1-R0 Heat Sink can also be used for cooling other types of components, such as power supply units, voltage regulators, and integrated circuits. It can also be used in applications where multiple heat sources need to be dissipated. Since the aluminum alloy allows for high thermal conductivity, it is an ideal choice for applications that require efficient cooling.
In summary, the ATS-07F-65-C1-R0 Heat Sink is a heat dissipating device designed for high-power applications. It is made of aluminum alloy and is designed to dissipate heat quickly, allowing for maximum cooling and efficiency. It is a good choice for cooling high power devices such as computers, servers, amplifiers, and other high power devices. It can also be used to cool other components, such as power supplies and voltage regulators. Understanding the application and working principle of thermal-heat sinks helps to determine the right design for a given application.
The specific data is subject to PDF, and the above content is for reference