| Allicdata Part #: | ATS-07F-80-C1-R0-ND |
| Manufacturer Part#: |
ATS-07F-80-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-80-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat SinksNo matter the scale, thermal management remains of an utmost importance – controlling the heat in various operations to support the equipment’s maximum performance. Heat sinks play a major role in this endeavor and are essential when it comes to increasing surface area and ensuring an efficient system of heat dispersion. ATS-07F-80-C1-R0 is a specialized heat sink designed to service a range of applications and operating environments.
ATS-07F-80-C1-R0 heat sinks are designed to dissipate heat from a variety of devices. Typical applications include power supplies, power amplifiers, SMT\'s, hybrid and DC-DC converters, as well as telecom rectifier assemblies. They come in a wide range of sizes and are designed to disperse heat away from the component being cooled, ensuring maximized performance of the device. The device is composed of an aluminum finned heat sink, which is attached to a copper base plate.
The aluminum fins provide a large surface area for servicing increased heat dissipation requirements. Heat is forced to travel along the surface area and is drawn away from the device, reducing temperature and preventing the component to overheat. Although an effective solution to many thermal management tasks, the heat sink should not be considered as a replacement for some form of active cooling system. ATS-07F-80-C1-R0 provides basic forms of passive thermal management and should always be used in conjunction with an additional, active cooling device.
The device is designed with an adjustable contact feature that allows the user to adjust the contact for improved thermal performance. Through this design, the heat sink provides a more customized form of thermal management, distributing heat evenly and reducing heat spots. This feature also offers added value, as it can compensate for any warping or curvature of the component being cooled.
ATS-07F-80-C1-R0 is an ideal choice for those who require a reliable and efficient heat sink. The device offers a range of features that allows it to be used in a wide variety of applications. In addition, its adjustable contact feature allows it to adapt to components of all shapes and sizes. With its effectiveness and reliability, the ATS-07F-80-C1-R0 heat sink is certain to provide superior thermal management performances.
The specific data is subject to PDF, and the above content is for reference