| Allicdata Part #: | ATS13313-ND |
| Manufacturer Part#: |
ATS-07F-80-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-80-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are an essential part of heat transfer and dissipation in the modern computer system. They are used in many applications ranging from small embedded systems to large computer systems. The ATS-07F-80-C2-R0 is a fan-mounted, cooling heat sink designed to maximize heat transfer and dissipation within the system.
The ATS-07F-80-C2-R0 is designed for a low profile physical installation. The heat sink has a height of 80mm and a maximum spread of 86mm. This provides an ideal form factor for use within embedded systems and other small form factor applications. The airframe of the ATS-07F-80-C2-R0 is constructed from high quality aluminum alloy which provides excellent heat conduction and reduces high temperatures. The base of the sink is milled for optimal uniform heat transfer from the device to the sink.
The cooling performance of the ATS-07F-80-C2-R0 is further enhanced by an ultra-thin fan mounted to the top of the heat sink. The fan has a thickness of 15mm and a fan speed of 2000rpm. The 200 millimeter fan provides an airflow capacity of up to 48 cubic feet per minute, which is enough to effectively dissipate the heat generated by the device. The fan is also designed to reduce noise and maintain a low operating temperature.
The ATS-07F-80-C2-R0 is designed to provide cooling and heat dissipation for electronic devices such as microprocessors, memory, and other integrated circuits. It is also suitable for use in servers, desktop computers, routers, and other applications where heat is generated. The heat sink is designed to maintain optimal thermal conditions and help the device perform at its best.
The working principle of the ATS-07F-80-C2-R0 is to maximize heat transfer and dissipation from the device. Heat is generated by the electronic device which is then conducted to the milled heat sink base. The heat is then dissipated from the heat sink to the surrounding air. The fan expels the hot air from the system, maintaining an optimal thermal environment for the device to operate in.
The ATS-07F-80-C2-R0 is made from high grade materials and designed to provide optimal cooling and heat dissipation. Its low profile height and small footprint make it ideal for embedded systems, small form factor applications, and other electronic devices. It is also easy to install and maintain, making it the perfect solution for cooling and heat dissipation in any application.
The specific data is subject to PDF, and the above content is for reference