ATS-07F-81-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-07F-81-C1-R0-ND

Manufacturer Part#:

ATS-07F-81-C1-R0

Price: $ 3.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07F-81-C1-R0 datasheetATS-07F-81-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.03156
30 +: $ 2.94945
50 +: $ 2.78573
100 +: $ 2.62181
250 +: $ 2.45796
500 +: $ 2.37602
1000 +: $ 2.13022
Stock 1000Can Ship Immediately
$ 3.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important aspect of any system, and heat sink assemblies are integral components of many thermal solutions. ATS-07F-81-C1-R0 is a heat sink assembly with a highly efficient design that allows it to effectively dissipate the tremendous amounts of heat that can be produced by modern high-temperature systems. This heat sink assembly is designed for use in applications where maximum thermal performance is desired.

The ATS-07F-81-C1-R0 is constructed of a copper base and multiple aluminum fins. The copper base carries the heat away from the system via conduction, while the aluminum fins disperse the heat into the ambient air by convection. The base is designed with a large surface area containing numerous heat resources. This ensures that the maximum amount of heat is dissipated from the system, and that the temperature remains low.

The ATS-07F-81-C1-R0 is designed for use in a wide range of applications. It can be used in industrial and medical equipment, computers and servers, consumer electronics, and other equipment where low temperatures are necessary. The heat sink assembly can also be used in automotive, aerospace, and other high-temperature applications, as its design is able to dissipate large amounts of heat while maintaining a low operating temperature.

The ATS-07F-81-C1-R0 is a highly efficient heat sink assembly that is designed for maximum thermal performance. Its copper base and aluminum fins allow for efficient heat conduction and convection, resulting in a low operating temperature even under extreme conditions. This heat sink assembly is designed for use in a variety of applications, and its superior design makes it ideal for industrial, medical, and other applications where temperature control is vital.

The specific data is subject to PDF, and the above content is for reference

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