ATS-07F-82-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.74°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are components or devices that dissipate heat generated from an electronic component or processor. They work by drawing thermal energy into the heat sink fins, which dissipates the heat into the air. The ATS-07F-82-C1-R0 heat sink is one type of heat sink designed to deliver exceptional performance with thermal protection. This article discusses its application field, working principle, and features.

Application field

The ATS-07F-82-C1-R0 heat sink is designed to be used for various high-power electronic components, such as CPUs, GPUs, and power transistors. These components often generate a large amount of heat due to their high electrical demands and need a proper cooling solution for them to operate reliably.The ATS-07F-82-C1-R0 heat sink is designed with a number of features that meet the requirements of these applications, such as a large heat dissipation surface area, high-quality materials, and advanced construction techniques. The ATS-07F-82-C1-R0 heat sink is designed for use in a variety of applications, including personal computers, servers, aerospace, military, consumer electronics, industrial control systems, and medical systems.

Working Principle of ATS-07F-82-C1-R0 Heat Sink

The ATS-07F-82-C1-R0 heat sink follows a basic working principle of heat transfer and dissipation. In operation, thermal energy from the heat source is transferred to the surface of the heat sink. The heat is then conducted through the portion of the heat sink touching the source and further conducted into the fins of the heat sink. The fins are designed to maximize the surface area in contact with the air, so the heat continues to be dissipated away from the heat source. The air is thus the primary medium used to absorb the transferred thermal energy and prevent the heat from returning to the source.The ATS-07F-82-C1-R0 heat sink is constructed from materials specifically designed to conduct thermal energy away from the source quickly and efficiently. The construction and materials used in the ATS-07F-82-C1-R0 heat sink enable it to achieve high levels of thermal performance.When used in an appropriate heat dissipation environment, the ATS-07F-82-C1-R0 heat sink can effectively cool electronic components, allowing them to operate at their specified performance levels.

Features of ATS-07F-82-C1-R0 Heat Sink

The ATS-07F-82-C1-R0 heat sink has several important features that make it suitable for a wide range of applications. Firstly, the ATS-07F-82-C1-R0 heat sink is designed to provide reliable and efficient thermal protection. It features a number of technologies designed to reduce the amount of heat generated and increase the thermal conductivity of the heat sink. The fins on the heat sink are designed to maximize the surface area in contact with the air, increasing the amount of heat that can be dissipated away from the source.Secondly, the ATS-07F-82-C1-R0 heat sink is built from high-quality materials that can withstand extreme temperatures and provide long-term stability. This ensures that the system can operate safely and reliably over long periods of time. Finally, the ATS-07F-82-C1-R0 heat sink is designed to be incredibly durable, withstanding harsh environments and high levels of mechanical stress. This makes it an ideal choice for applications operating in extreme environments.

Conclusion

The ATS-07F-82-C1-R0 heat sink is a highly efficient and reliable device designed to dissipate heat away from high-power processors and other electronic components. It features a number of advanced technologies and features that enable it to dissipate heat quickly and efficiently. The heat sink is also designed to provide long-term durability and stability, making it a suitable choice for a range of applications.

The specific data is subject to PDF, and the above content is for reference