| Allicdata Part #: | ATS-07G-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-07G-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07G-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
A thermal heat sink is an essential component of any electronic device, used to dissipate heat away from the system or component. The ATS-07G-10-C1-R0 is a heat sink designed for various mainboard applications, with an optimized fin height for low-profile installations. It has a fanless design with a high thermal conductivity, and features a natural anodized aluminum fins for maximum heat dissipation.
Application Field
The ATS-07G-10-C1-R0 heat sink is designed for a wide range of motherboard applications, including ATX and Mini-ITX formats, as well as mini PCI-E and mini PCIe slots. It is suitable for both passive and active cooling systems, and can be used with desktop and laptop computers. Additionally, it is compatible with motherboards designed for either Intel or AMD processors.
Working Principle
The ATS-07G-10-C1-R0 heat sink works by dissipating heat away from the system or component. The anodized aluminium fins remove heat through thermal radiation, and the heat is then dissipated through convection on the cooler surrounding air. The thermal heat sink acts as an additional layer of insulation between the air and the component, ensuring that temperatures remain sufficiently low and providing protection to the system. The design of the sink also ensures maximum air flow and heat dissipation.
Benefits
The ATS-07G-10-C1-R0 thermal heat sink has a few benefits compared to conventional active cooling systems. It requires no fan, leading to greater energy efficiency and a much quieter user experience. The high thermal conductivity ensures that heat is removed from the system as quickly as possible. Additionally, its optimized fin height allows the sink to fit in low-profile installations. Finally, the both anodized aluminium fins are corrosion-resistant, meaning the heat sink will last significantly longer.
Conclusion
The ATS-07G-10-C1-R0 is a high-performance thermal heat sink designed for various mainboard applications. Its fanless design provides greater energy efficiency, and the anodized aluminum fins provide maximum heat dissipation. The optimized fin height allows for installation in low-profile systems, and the corrosion-resistant nature of the fins ensures a longer lifespan than other active cooling systems. This makes the ATS-07G-10-C1-R0 an excellent thermal heat sink choice for any electronic device.
The specific data is subject to PDF, and the above content is for reference