| Allicdata Part #: | ATS-07G-100-C1-R0-ND |
| Manufacturer Part#: |
ATS-07G-100-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07G-100-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal energy, an integral part of our lives, is generated when energy changes states or when energy undergoes transformation in its essential form. It usually occurs in the form of heat. Heat sinks are devices used to control the temperature by dissipating thermal energy. They are also used to manage the heat generated by electronic devices and to increase the performance and efficiency of those devices. ATS-07G-100-C1-R0 is a heat sink designed to dissipate thermal energy efficiently. This article looks into its application field and working principle.
The ATS-07G-100-C1-R0 heat sink can be used in a wide variety of applications. It can be used in the cooling of power supplies, microprocessors, voltage regulators, and other electronics. It is also suitable for many industrial applications such as metrology, medical, communications, data center, and communications technologies. The heat sink is designed to work in ambient temperatures between 0 °C and +85 °C and can handle a maximum temperature of +125 °C.
The ATS-07G-100-C1-R0 heat sink works by dissipating heat through a number of components such as a heat sink base, thermal compound and a fan. The heat sink base is a flat molded enclosure that is designed to provide a base for the heat sink to sit on and help disperse heat. The thermal compound is a non-conductive material, usually a silicone base, which is used to transfer heat more efficiently from the device to the heat sink. The fan is the part that helps pull the heat away from the device and disperses it into the atmosphere. The fan can also be used to regulate the temperature so it does not exceed the set limits.
The heat sink is also designed to ensure reliability and high-performance cooling in any application. The heat sink is made of aluminum and its fins are designed for maximum surface area and optimal convection. The heat sink is also designed to eliminate side-force interference. The fins on the heat sink have been carefully designed with rounded edges to ensure that each fin can move independently of the others without generating any extra noise or vibration. The heat sink also has an effective heat dissipation rate which is achieved through the use of heat pipes and efficient air-flow.
In summary, the ATS-07G-100-C1-R0 heat sink is an efficient and reliable device designed for dissipating thermal energy in many different applications. Its design ensures that heat can be removed quickly and reliably ensuring that electronic devices work effectively and efficiently. The heat sink is also designed to ensure that it does not generate any noise or vibration in order to eliminate side-force interference. The combination of its heat dissipating components and its carefully designed fins make it an effective and reliable heat sink.
The specific data is subject to PDF, and the above content is for reference