ATS-07G-117-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-07G-117-C1-R0-ND

Manufacturer Part#:

ATS-07G-117-C1-R0

Price: $ 3.09
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07G-117-C1-R0 datasheetATS-07G-117-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.78208
30 +: $ 2.70669
50 +: $ 2.55629
100 +: $ 2.40591
250 +: $ 2.25553
500 +: $ 2.18034
1000 +: $ 1.95479
Stock 1000Can Ship Immediately
$ 3.09
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management plays an important role in many end applications, such as industrial electronics, medical devices, consumer electronics, and so on. This is especially true for applications that require efficient removal of heat generated on electronic components. In this case, it is important to use a reliable and efficient thermal management solution. Among the many thermal management solutions available, Thermal - Heat Sinks, such as the model ATS-07G-117-C1-R0, prove to be an excellent choice.

Heat sinks come in varied shapes, sizes and materials. They consist of pins, channels, and a base plate, all designed to efficiently dissipate heat away from the component. The ATS-07G-117-C1-R0 heat sink, in particular, uses a high performance pin design with an integrated base plate. This ensures that the heat sinks are able to dissipate thermal energy more quickly and efficiently. The pins are designed to provide an additional level of protection for electronic components, as they provide better air flow and an even distribution of heat.

The ATS-07G-117-C1-R0 heat sink also features an innovative design. It has a dual split-fin design, with the top fins pointing outward and the bottom fins pointing inward. This ensures that air flow is directed in an efficient manner, providing better heat dissipation. Additionally, the fins are strategically positioned in order to provide an even distribution of heat throughout the heat sink. This helps to keep the components from overheating, which is critical for reliable electronic operation.

The ATS-07G-117-C1-R0 heat sink works on a simple principle. Thermal energy is generated within the component, which is then absorbed by the heat sink through convection. The thermal energy is then dissipated to the atmosphere, generally through the use of fans. The fans help to move the air over the fins, which further promotes heat dissipation.

The ATS-07G-117-C1-R0 heat sink can be applied in numerous applications. They are ideal for use in electronic devices that require long-term operation and reliable performance in harsh environments. This includes computers, industrial machinery, medical equipment, LED lighting, automotive electronics, telecommunications, and many others. The heat sink is also ideal for applications that require compact and low-profile thermal solutions, such as mobile phones, tablets, wearable devices, and other consumer electronics.

In conclusion, the ATS-07G-117-C1-R0 heat sink is a reliable and efficient thermal management solution for a variety of applications. It features an innovative design, with a dual split-fin construction for improved air flow. The fins are strategically positioned to provide an even distribution of heat throughout the heat sink, keeping components from overheating. The ATS-07G-117-C1-R0 heat sink is ideal for applications requiring reliable, long-term operation in harsh environments, and in areas where a compact, low-profile thermal solution is needed.

The specific data is subject to PDF, and the above content is for reference

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