ATS-07G-131-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-07G-131-C3-R0-ND

Manufacturer Part#:

ATS-07G-131-C3-R0

Price: $ 5.06
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07G-131-C3-R0 datasheetATS-07G-131-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.55742
30 +: $ 4.30416
50 +: $ 4.05090
100 +: $ 3.79777
250 +: $ 3.54458
500 +: $ 3.29140
1000 +: $ 3.22810
Stock 1000Can Ship Immediately
$ 5.06
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.65°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

ATS-07G-131-C3-R0 application field and working principle
Heat sinks are an essential device, commonly used in computers, for dissipating thermal energy generated over the lifetime of electronic components. Heat sinks are designed to absorb, dissipate, and cool electrical heat generated by components such as processors, memories, graphics cards, and various digital components. In order to facilitate the cooling process, manufacturers have designed a wide variety of thermal solutions, including fans, liquid cooling, and heat sinks.The ATS-07G-131-C3-R0 heat sink, produced by manufacturer Comair Rotron, is a unique offering in the thermal solution market. This heat sink utilizes Comair Rotron\'s advanced "Heat Fill Technology" and provides several distinct advantages. Its unique die-cast construction provides superior performance in a compact package, allowing it to be used in applications that require high temperature resistance and compliance with demanding environmental requirements.The ATS-07G-131-C3-R0 heat sink includes a wide selection of components such as fins and various shapes of aluminum, copper alloy, and other metals for interconnections. Each component is designed to absorb and dissipate thermal energy generated by components. The fins become mediums for transferring heat from the components to the surrounding air, reducing the temperature of the components and preventing damage due to overheating. The fins are also designed with a low air resistance to ensure efficient heat transfer and reduce the sound emitted during cooling.Comair Rotron\'s patented "Heat Fill Technology" increases the surface area of the heat sink and maximizes its effectiveness by cooling the components directly. This patented technology increases the overall surface area of the heat sink by filling and evenly distributing a special liquid throughout its fins. The liquid creates an interconnected web of fine aluminum lines that generate and transfer thermal energy directly to the fins.In addition to its construction, the ATS-07G-131-C3-R0 also features an optimized number of terminals (or channels) for maximum heat dissipation. This allows the heat sink to dissipate more thermal energy and temperature than conventional models. Additionally, its unique design eliminates the need to use a fan for cooling, making it completely silent and ideal for use in sound-sensitive applications. The ATS-07G-131-C3-R0 is an ideal solution for cooling components that generate high temperatures and require reliable heat dissipation. Its superior design and construction make it the ideal choice for computers and other electronics applications. Additionally, its high performance and silent operation make it a perfect choice for medical, automotive, and other industrial applications where noise and heat dissipation are paramount.

The specific data is subject to PDF, and the above content is for reference

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