| Allicdata Part #: | ATS13386-ND |
| Manufacturer Part#: |
ATS-07G-14-C2-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07G-14-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.95640 |
| 10 +: | $ 3.85182 |
| 25 +: | $ 3.63787 |
| 50 +: | $ 3.42380 |
| 100 +: | $ 3.20979 |
| 250 +: | $ 2.99580 |
| 500 +: | $ 2.78181 |
| 1000 +: | $ 2.72832 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-07G-14-C2-R0 is a type of thermal heat sink which has many uses. It is commonly used in a variety of applications, such as in cooling or dissipating heat from electronic components. In some cases, it is also used as an inlet for hot air or water. By efficiently distributing the heat around the component, the heat sink helps to preserve the device and prevent it from overheating.
The ATS-07G-14-C2-R0 is composed of a metal base with fins attached. The metal base is typically made from aluminum, copper, or other material that has good thermal conductivity. The fins create a larger surface area, which allows for more efficient transfer of heat away from the component. This ensures that the device will operate within its designed temperature range.
The ATS-07G-14-C2-R0 is a two-stage, vapour-chamber heat sink. The first stage is a metal heat spreader, which delivers heat away from the device. This is then followed by a chamber filled with a heat transfer fluid. This fluid circulates around the components, absorbing any additional heat, and then transfers it away to a secondary chamber. This secondary chamber further dissipates the remaining heat.
The amount of heat that is dissipated is proportional to the size of the heatsink and the materials that are used. The larger and more efficient the heatsink, the more heat it can dissipate. The ATS-07G-14-C2-R0, due to its large surface area, is able to dissipate a large amount of heat. This makes it a popular choice for devices that require high temperatures.
The application field of the ATS-07G-14-C2-R0 is extremely varied. Some of the most common applications are in medical, radio, defence, space, and automotive industries. It is widely used in any situation where high levels of heat need to be dissipated. It is also frequently used for cooling hot components in computer and device manufacturing.
In summary, the ATS-07G-14-C2-R0 is a thermal-heat sink that is used to efficiently dissipate heat from components. Its two-stage, vapour-chamber design creates a large surface area which allows for maximum efficiency in the transfer of heat. Its wide range of applications and ability to dissipate a large amount of heat make it a popular choice in many industries. This heat sink is essential for any situation where high levels of heat must be dissipated in order to protect and preserve the component.
The specific data is subject to PDF, and the above content is for reference