| Allicdata Part #: | ATS13398-ND |
| Manufacturer Part#: |
ATS-07G-150-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07G-150-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a familiar sight when it comes to cooling electronics. They are specially designed to draw heat away from components to keep them within their temperature operating range and protect them from overheating. The ATS-07G-150-C2-R0 heat sink is specifically designed to meet a wide range of applications and have a strong working principle.
The ATS-07G-150-C2-R0 thermal-heat sink is designed to provide effective cooling in a range of applications such as PC chassis, power controllers, electronic tire pumps and drone control systems. It offers a maximum air flow rate of 150CFM and is compatible with both air and liquid cooling systems. The robust construction of the heat sink also ensures that it can withstand extreme temperatures of up to 100C. This makes the ATS-07G-150-C2-R0 an ideal choice for applications that require high efficiency cooling.
The working principle of the ATS-07G-150-C2-R0 thermal-heat sink is based on principles of thermodynamics. As heat is generated within the component it is transferred to the cooling fins of the heat sink. The fins act as a conduit, drawing away the heat and dissipating it into the surrounding air. The larger surface area of the fins ensures a greater heat transfer rate as more air is in contact with the fins. The heat is then drawn away by the air flows produced by the fans. This process keeps the components within their operating temperature ranges and reduces the possibility of overheating and permanent damage.
In addition, the ATS-07G-150-C2-R0 thermal-heat sink is also capable of increasing the efficiency of cooling systems. By increasing the amount of air flowing across the component, the heat transfer rate is increased. This helps to ensure that the components are cooled faster and more efficiently. As a result, the overall system performance is improved and the risk of component failure is greatly reduced.
The ATS-07G-150-C2-R0 thermal-heat sink offers a reliable, high performance solution when it comes to cooling electronic components. With its robust construction and reliable working principle, it is the perfect choice for applications that require efficient cooling. It is also easy to install and is compatible with a wide range of cooling systems. As such, it is an ideal choice for any application that needs reliable, high performance cooling.
The specific data is subject to PDF, and the above content is for reference