ATS-07G-20-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-07G-20-C1-R0-ND

Manufacturer Part#:

ATS-07G-20-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07G-20-C1-R0 datasheetATS-07G-20-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are a type of device that is used to absorb and dissipate heat from electronic components and systems. The ATS-07G-20-C1-R0 is an advanced thermal heat sink specifically designed for applications that require efficient removal of generated heat from CPUs, power amplifiers, and other heat generating components. It is constructed using an aluminum alloy material with advanced heat sink fins that provide excellent thermal conductivity and heat dissipation.

The ATS-07G-20-C1-R0 is a precise assembly of advanced heat sink components, designed to provide optimal performance for cooling large-scale component systems. It has an adjustable height, making it suitable for various component mounting requirements. In addition, the ATS-07G-20-C1-R0 comes equipped with a set of thermally conductive heat spreaders, designed to create an even distribution of heat throughout the component. This helps to ensure that each component can be cooled efficiently.

The ATS-07G-20-C1-R0 has been specifically manufactured for use in a wide range of applications. It can be used in conjunction with electronic components such as power amplifiers, CPUs, circuit boards, and other heat-producing components to efficiently dissipate heat. It is often used in industrial applications, such as power supply control systems, computer systems, medical equipment, telecom equipment, and lighting systems.

The working principle behind the ATS-07G-20-C1-R0 is simple. Once the heat produced by the individual components is combined into one area, the heat sink absorbs and dissipates it to the surrounding environment. The heat sink fins are designed to create convection currents that move the heated air away from the components and the heat sink assembly, thus maintaining an optimal operating temperature for the components.

The ATS-07G-20-C1-R0 thermal-heat sink is designed with the environment in mind, and is made from materials that are highly recyclable. It is designed for easy installation and removal, and requires minimal maintenance to ensure reliable and efficient operation. With its robust construction and adjustable height, the ATS-07G-20-C1-R0 is a great thermal solution for any application where high temperatures and effective cooling are a priority.

The specific data is subject to PDF, and the above content is for reference

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