Allicdata Part #: | ATS-07G-20-C3-R0-ND |
Manufacturer Part#: |
ATS-07G-20-C3-R0 |
Price: | $ 4.67 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-07G-20-C3-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 4.19895 |
30 +: | $ 3.96543 |
50 +: | $ 3.73225 |
100 +: | $ 3.49896 |
250 +: | $ 3.26570 |
500 +: | $ 3.03243 |
1000 +: | $ 2.97412 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-07G-20-C3-R0 is an efficient thermal solution for a variety of applications - from everyday electronics to heavy-duty commercial and industrial applications. With its unique fin-type design, this heat sink is able to dissipate heat quickly, making it perfect for a range of applications. In this article, we will take a look at the application field and working principle of the ATS-07G-20-C3-R0.
The ATS-07G-20-C3-R0 is part of a family of heat sinks designed for efficient heat dissipation. This heat sink is an ideal choice for applications that need high thermal conductivity, such as high-power electronic components. The fin-type design of the ATS-07G-20-C3-R0 allows for maximum cooling efficiency and higher thermal transfer rates. This heat sink is a great choice for applications requiring quick heat transfer and cooling.
The ATS-07G-20-C3-R0 is designed for use in a wide range of applications, including computing, industrial machinery, consumer electronics, automotive electronics, power supplies, and LED lighting. This heat sink is particularly useful for applications requiring extended cooling periods, as it is able to sustain high temperatures over a long period of time. In addition, this heat sink is also designed to keep components cool when the ambient temperature is high, allowing for better performance and reliability.
The ATS-07G-20-C3-R0 works on an Air-to-Air Heat Transfer Principle. This is how it works: The heat sink has a large fin surface area which is exposed to the airflow, and as the air moves through the fins, heat is transported away from the component and dissipated into the environment. The aluminum fins of the ATS-07G-20-C3-R0 act as a large surface area to allow for maximum heat transfer. This allows for more efficient cooling of the component.
The ATS-07G-20-C3-R0 also employs a Type-II Heat Dissipation technology, which further provides an efficient cooling solution. The fins of this heat sink are arranged closely together in multiple rows and highly parallel, allowing for a higher level of thermal transfer. This ensures that the heat can be dissipated quickly and efficiently from the component to the environment.
The ATS-07G-20-C3-R0 is a great choice for those seeking an efficient thermal solution for a variety of applications. Its high-efficiency fin-type design helps to efficiently dissipate heat, while its Type-II Heat Dissipation technology ensures that the component stays cool and reliable. This makes the ATS-07G-20-C3-R0 ideal for applications requiring extended cooling periods or high thermal transfer rates. As a result, it is a versatile thermal solution that can be used in a variety of applications and environments.
The specific data is subject to PDF, and the above content is for reference