ATS-07G-23-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-07G-23-C3-R0-ND

Manufacturer Part#:

ATS-07G-23-C3-R0

Price: $ 5.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07G-23-C3-R0 datasheetATS-07G-23-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.60341
30 +: $ 4.34784
50 +: $ 4.09210
100 +: $ 3.83632
250 +: $ 3.58057
500 +: $ 3.32481
1000 +: $ 3.26087
Stock 1000Can Ship Immediately
$ 5.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are used to draw heat away from electronic components to prevent them from overheating. The most common type of heat sink is the aluminum fin, which is formed from an aluminum block and includes a series of fins attached to it. The ATS-07G-23-C3-R0 heat sink is a type of aluminum fin heat sink.

The ATS-07G-23-C3-R0 heat sink is a thermal solution designed to either dissipate or manage the thermal energy generated from electronic components. It is designed to improve component reliability, allowing components to operate at higher temperatures for an extended period of time without experiencing permanent damage. The ATS-07G-23-C3-R0 heat sink is made of lightweight, durable aluminum fins which allow for more efficient thermal transfer when compared to traditional copper heat sinks. It features a three-fin design, which ensures that the maximum amount of heat is dissipated or managed and that maximum device performance is achieved.

The ATS-07G-23-C3-R0 heat sink is designed to be used in a wide range of applications. It is ideal for use in consumer electronics, such as cameras, cell phones, and video game consoles. The fin design of the heat sink allows it to be used in industrial applications as well, such as in high-power LED lighting and military and aerospace equipment. The ATS-07G-23-C3-R0 is also suitable for medical imaging, communications, and computing applications.

The working principle of the ATS-07G-23-C3-R0 heat sink is relatively simple. The aluminum fins of the heat sink work as a heat conductor, absorbing the heat generated from the device or component it is mounted to. This heat is then processed by a series of small channels inside the aluminum fins, which disperse the heat and allow it to dissipate into the air around the heat sink. This helps to keep the temperature of the device or component within its safe operating limits, ensuring it runs at optimal performance.

In conclusion, the ATS-07G-23-C3-R0 heat sink is an effective thermal solution for a wide range of applications. Its lightweight aluminum fins enable efficient thermal transfer, allowing for better device performance and improved lifespans. The working principle of the heat sink is also relatively simple, and it is capable of effectively dissipating the heat generated from the device or component it is mounted to.

The specific data is subject to PDF, and the above content is for reference

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