| Allicdata Part #: | ATS-07G-31-C2-R0-ND |
| Manufacturer Part#: |
ATS-07G-31-C2-R0 |
| Price: | $ 5.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X5.84MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07G-31-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.08914 |
| 30 +: | $ 4.80669 |
| 50 +: | $ 4.52390 |
| 100 +: | $ 4.24116 |
| 250 +: | $ 3.95842 |
| 500 +: | $ 3.67567 |
| 1000 +: | $ 3.60499 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 25.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are vital for many modern electronic devices. Heat sinks are one of the most effective solutions for managing thermal requirements. The ATS-07G-31-C2-R0 is an example of a high performing heat sink specifically designed for cooling modern electronic components. In this article, we will look at the application field and working principle of the ATS-07G-31-C2-R0.
The ATS-07G-31-C2-R0 is a versatile and compact heat sink designed to provide cooling for a wide range of applications. It is equipped with a copper base plate and aluminum heat spreaders to allow for effective heat dissipation. The heat spreaders feature cooling fins that help to ensure efficient heat transfer from the device to the ambient environment. The heat spreaders come in a variety of sizes and configurations, making them suitable for a variety of thermal management requirements. Additionally, the copper base plate and aluminum heat spreaders provide enhanced mechanical strength for the heat sink.
The ATS-07G-31-C2-R0 provides superior thermal management in a small and lightweight package. It is capable of providing up to 10W of active cooling, making it suitable for even the most demanding thermal requirements. Additionally, the heat sink is optimized for zero warm-up time, allowing for rapid heat dissipation and improved reliability in critical applications. The combination of a highly efficient heat transfer and mechanical strength ensure optimal performance in a variety of applications.
The working principle of the ATS-07G-31-C2-R0 is based on the laws of thermodynamics. Heat is generated from the electronics components being cooled and is transferred by conduction through the heat spreaders to the copper base plate. The heat is then transferred to the ambient environment through the cooling fins and dissipated into the surrounding air. The combination of the copper base plate and aluminum heat spreaders acts as an efficient and effective thermal bridge allowing for maximum heat transfer while minimizing thermal resistance.
The ATS-07G-31-C2-R0 is a highly effective and efficient heat sink, making it an ideal solution for cooling sensitive electronics components. Its versatility, light weight, mechanical strength and optimized performance make it suitable for a variety of applications. From power electronics and LED lighting to communications equipment and consumer electronics, the ATS-07G-31-C2-R0 is a reliable and cost-effective solution for managing thermal requirements.
The specific data is subject to PDF, and the above content is for reference