| Allicdata Part #: | ATS-07H-03-C1-R0-ND |
| Manufacturer Part#: |
ATS-07H-03-C1-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07H-03-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.83°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a key factor in the design and manufacture of many electronic devices. Electronics are sensitive to excess heat, and proper cooling systems must be designed and implemented to prevent component failure and ensure system reliability. ATS-07H-03-C1-R0 thermal management hardware is a low-profile, efficient heat sink for thermal control and dissipating heat in potentially high temperature working zones. This heat sink solution has found a wide range of applications in many industries.
Application Field of ATS-07H-03-C1-R0
The ATS-07H-03-C1-R0 is a heat sink that can dissipate large amounts of energy quickly and efficiently in areas with limited space. It is designed for tight spaces found in the interiors of computers, networking and communication equipment, and industrial automation control systems. This thermal control can promote long-term reliability of electronic components and reduce the risk of catastrophic failure. In addition, this heat sink can also provide stable and reliable thermal management solutions for cooling applications in medical, military, and aerospace applications. It is also used in high-temperature enclosures such as solar panels.
Working Principle of ATS-07H-03-C1-R0
The ATS-07H-03-C1-R0 thermal management product uses convective dissipating method to transfer the heat energy produced by the system into the external environment. The heat sink quickly absorbs the generated heat energy, dissipates it into the air by the fins, and constantly refreshes the surrounding air to keep the surrounding temperature down.The ATS-07H-03-C1-R0 dissipates heat by utilizing a combination of thermal materials, such as aluminum, copper, and copper-clad aluminum, that are designed for maximum thermal performance in tight spaces. The copper has been proven to be particularly effective at dissipating large amounts of heat due to its superior heat conductivity, allowing the heat to quickly move away from the device and out of the system. The fin configuration also allows for a large surface area, allowing more air contact, thus maximizing the heat dissipation. This heat sink is also designed with a nice low profile, allowing for a seamless integration into the area without any physical obstructions.
Conclusion
The ATS-07H-03-C1-R0 thermal management heat sink is an ideal solution for electronics in industries with limited space. It features a low profile design, making it easy to integrate into the area, and a combination of superior thermal materials that can effectively and efficiently dissipate the heat away from the device. This product is ideal for thermal management in industrial automation control systems, medical, military, and aerospace applications.
The specific data is subject to PDF, and the above content is for reference