ATS-07H-136-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-07H-136-C1-R0-ND

Manufacturer Part#:

ATS-07H-136-C1-R0

Price: $ 6.36
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07H-136-C1-R0 datasheetATS-07H-136-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.72544
30 +: $ 5.40750
50 +: $ 5.08939
100 +: $ 4.77131
250 +: $ 4.45322
500 +: $ 4.13513
1000 +: $ 4.05561
Stock 1000Can Ship Immediately
$ 6.36
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.17°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-07H-136-C1-R0 thermal-heat sinks are widely used in a variety of applications, which requires the transfer of large quantities of thermal energy into the surrounding environment. The ATS-07H-136-C1-R0 thermal-heat sinks have a design that allows them to absorb and dissipate heat efficiently, preventing the heat from accumulating too much inside the electronic device or other surrounding areas. They are usually used to cool down electronic components, such as chips, CPUs, and ASICs.

The ATS-07H-136-C1-R0 thermal-heat sinks are constructed with an efficient aluminum housing that has a large number of heat-conduction fins that are used to dissipate the heat from the heat conduction medium. This aluminum housing has a simple yet effective design that is designed to keep the heat away from sensitive components such as chipsets and delicate ASICs. The heat is then disseminated and dissipated to the surrounding environment, which is usually air.

The ATS-07H-136-C1-R0 thermal-heat sinks are also designed with a high-efficiency heat-exchanger that is used to transfer the thermal energy from the heat transfer medium to the surrounding environment. This makes the heat-exchanger highly efficient at transferring thermal energy and is capable of transferring a lot of thermal energy quickly and efficiently.

The ATS-07H-136-C1-R0 thermal-heat sinks are constructed using an optimized heat conduction mechanism. This mechanism is designed to the optimal level so that the heat from the device or component is efficiently and quickly transferred to the surrounding environment. This ensures that the device does not overheat and that the temperature inside the electronic device is safe and maintained.

The ATS-07H-136-C1-R0 thermal-heat sinks are also designed with a unique airflow system that is highly efficient. This airflow system is designed in such a way that it disperses the heat evenly throughout the device, which keeps the temperature of the device at a lower level. This also reduces the total heat load that the device must bear and allows the device to remain cooler for an extended period of time.

The ATS-07H-136-C1-R0 thermal-heat sinks also feature a fan that is designed to draw air from the surrounding environment and circulate it throughout the device. This fan helps to ensure that the device remains cool, and it also helps to keep the surrounding environment cooler, as well.

The ATS-07H-136-C1-R0 thermal-heat sinks are incredibly efficient at transferring thermal energy to the surrounding environment. This is why they are so widely used in a variety of applications, which require the transfer of large amounts of thermal energy into the environment. By utilizing the ATS-07H-136-C1-R0 thermal-heat sinks, electronic components and devices can remain cooler for extended periods of time and the surrounding environment remains comfortable and safe.

The specific data is subject to PDF, and the above content is for reference

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