| Allicdata Part #: | ATS-07H-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-07H-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07H-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are components that are designed to absorb and dissipate heat generated by electronic devices. In particular, they are used to protect sensitive semiconductors and other circuit components from high temperatures that can cause failure or impair performance. The ATS-07H-139-C1-R0 is a heat sink designed for use in specialty applications such as high-precision electronics and data center equipment that require efficient thermal management solutions.
The ATS-07H-139-C1-R0 is a compact heat sink designed for use in confined spaces and light-weight applications. It features a small footprint and is constructed from anodized aluminum for maximum efficiency and performance. The device is designed to operate with minimal noise and has a low power consumption rating. The ATS-07H-139-C1-R0 can be used in a wide variety of applications including in servers and PCs, medical imaging equipment, embedded controllers, and telecommunications products.
The ATS-07H-139-C1-R0 works by passively dissipating the heat generated by electronic devices using an efficient, fan-less, aluminum heat dissipation assembly. The device works by transferring the generated heat from the electronic device to the aluminum fins which then dissipates the heat by convection. Additionally, the ATS-07H-139-C1-R0 features a low-maintenance design with sealed fins that are easy to clean and maintain. This contributes to the device\'s low-power efficiency and ensures longevity of the device and the device\'s components.
The ATS-07H-139-C1-R0 also features a unique design that maximizes surface area while minimizing the size of the device itself. This allows for more efficient heat transfer, as more heat can be dissipated from a smaller footprint. Additionally, the device can be configured with various fan configurations to fit specific cooling requirements.
Overall, the ATS-07H-139-C1-R0 is an ideal heat sink for high precision electronic and data centers. The device is designed to occupy minimal space while providing efficient cooling. It can be easily configured for a variety of applications, and its design ensures low power consumption and easy maintenance.
The specific data is subject to PDF, and the above content is for reference