| Allicdata Part #: | ATS13606-ND |
| Manufacturer Part#: |
ATS-07H-16-C2-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07H-16-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.05090 |
| 10 +: | $ 3.94443 |
| 25 +: | $ 3.72506 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-07H-16-C2-R0 Passive Thermal Solution is a type of heat sink typically used for cooling thermally sensitive components such as processors, GPUs, memory chips, and other heat-generating electronic components. It is a two-piece heat sink designed with an aluminum base plate containing a layer of thermoelectric cooling fins. The fins are designed to dissipate heat from the component to the air, allowing the component to stay cool, even in high ambient temperatures. The heat sink is also designed to be low profile to fit in tight spaces.
The ATS-07H-16-C2-R0 incorporates an air-filled heat pipe to better dissipate heat in both directions, from the component to the air. The heat pipe connects the aluminum base plate to the cooling fins, and further promotes efficient heat transfer by creating a large contact area between the component and the fins. This thermal solution also allows for more effective heat distribution by drawing the heat away from the base of the component, and evenly distributing it away from the component.
The ATS-07H-16-C2-R0 is a popular choice for applications that require reliable, efficient thermal performance at a low profile height. The two-piece design makes installation simpler and easier, and the low profile height allows for easier integration into tight spaces. The air-filled heat pipe further enhances thermal performance by providing more efficient heat transfer from the component to the air. The ATS-07H-16-C2-R0 is an excellent choice for thermal sensitive electronic components that require reliable cooling performance in tight spaces.
The specific data is subject to PDF, and the above content is for reference