| Allicdata Part #: | ATS-07H-164-C1-R0-ND |
| Manufacturer Part#: |
ATS-07H-164-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-07H-164-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management, which involves the transfer of heat away from sensitive components in order to maintain their optimal performance and temperature levels, is critical in a wide range of applications and industries. Heat sinks are one of the most common cooling solutions used in these applications, and are an effective way of transferring heat away from a device in order to prevent it from overheating. The ATS-07H-164-C1-R0 is a type of heat sink specifically designed for mounting on circuit boards, and is well-suited for applications requiring low power and low profile applications.
The ATS-07H-164-C1-R0 heat sink is an ideal cooling solution for applications that require efficient heat transfer within a small space. It is designed with a vertically mounted aluminum fin stack that is highly efficient in dissipating heat away from the device. The fins of the ATS-07H-164-C1-R0 heat sink feature a dimpled surface, which increases their surface area and allows for greater heat dissipation. The fins also feature copper plating, which further increases their heat transfer capacity.
The ATS-07H-164-C1-R0 heat sink has a number of features that make it well-suited for applications requiring efficient heat transfer. Firstly, the heat sink\'s design allows for direct contact between the fins and the device, allowing heat to be more effectively transferred. Secondly, the heat sink has a wide operating temperature range, allowing it to be used in a variety of applications. Finally, the heat sink has a low profile, which makes it ideal for use in densely populated applications.
The ATS-07H-164-C1-R0 heat sink also features a simple installation process, which makes it a great choice for applications where time is of the essence. The heat sink mounts directly onto the circuit board, and is secured in place by two screws. The heat sink also features pre-applied thermal adhesive, which eliminates the need for additional mounting hardware. Once installed, the ATS-07H-164-C1-R0 heat sink will rapidly dissipate heat away from the device, ensuring optimal performance.
In conclusion, the ATS-07H-164-C1-R0 is an effective heat sink solution for applications requiring efficient heat transfer in a small form factor. Its low profile and wide operating temperature range make it suitable for a variety of environments, and its simple installation process ensures a quick and easy installation. With its efficient heat dissipation capabilities, the ATS-07H-164-C1-R0 heat sink is an ideal cooling solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference
ATS-07H-164-C1-R0 Datasheet/PDF