ATS-07H-23-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an imperative aspect of successful electronics engineering. Heat sources, such as electronic components and PCBs, must either be isolated or dissipated effectively in order for the device to maintain optimal performance. Thermal management of the device is achieved using various strategies such as vented enclosures, fans, or liquid cooling; however, a passive solution is preferred as it eliminates the need of any moving parts. One such passive solution is the application of a thermal-heat sink.

ATS-07H-23-C3-R0, manufactured by Advanced Thermal Solutions Inc., is one of the reliable passive thermal management solutions available in the market. ATS-07H-23-C3-R0 is a compact finned aluminum heat sink with an aluminum fin array embedded onto a flat aluminum base. It is lightweight and has excellent thermal properties; thus, it is an ideal solution for dissipation of heat generated in a variety of electronic devices.

The working principle of ATS-07H-23-C3-R0 can be explained best with the help of a basic heat transfer theory. Heat is generated in an electronic device due to the active components present in the device. In order to expel heat energy from the device, it is necessary to create a thermal gradient between its heat source and its environment. When the ATS-07H-23-C3-R0 heat sink is mounted onto the heat source, air currents are created due to the presence of hot spots on the heat sink. These air currents create a thermal gradient by dissipating the heat from the heat source to the surroundings.

ATS-07H-23-C3-R0 is suitable for a wide range of applications such as power devices, electronic components, embedded systems, and much more. It can be used in applications where the heat generated needs to be dissipated quickly and efficiently. It can also be used in closed systems, as it can reduce the temperature of the heat source substantially, thus reducing the need for additional cooling systems.

The features and benefits of ATS-07H-23-C3-R0 makes it an ideal choice for smart power applications as well. It is designed to effectively dissipate the heat generated within such systems without any requirement of additional cooling devices. Its excellent thermal properties can help to maintain the optimum temperature for efficient power management. With its seamless integration in the current design, it can save space and reduce manufacturing costs significantly.

In conclusion, ATS-07H-23-C3-R0 is a compact finned aluminum heat sink that is designed to effectively dissipate the heat generated by electronic devices. It is suitable for a wide range of applications such as embedded systems, power devices, and smart power applications. It has excellent thermal properties due to its fin array and can help to reduce manufacturing costs significantly.

The specific data is subject to PDF, and the above content is for reference