| Allicdata Part #: | ATS-07H-30-C1-R0-ND |
| Manufacturer Part#: |
ATS-07H-30-C1-R0 |
| Price: | $ 7.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07H-30-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.62760 |
| 30 +: | $ 6.25947 |
| 50 +: | $ 5.89138 |
| 100 +: | $ 5.52315 |
| 250 +: | $ 5.15494 |
| 500 +: | $ 4.78673 |
| 1000 +: | $ 4.69468 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are a system component that is used to absorb, transfer and dissipate thermal energy from processors and other electronic components in order to keep them safe from damaging levels of heat. Thermal energy is generated by several processes, the most common being a result of the electrical current flow as it passes through a component. This energy must be dissipated in order to prevent the component from overheating and failing. The ATS-07H-30-C1-R0 is one type of heat sink that is used to dissipate this thermal energy.
The ATS-07H-30-C1-R0 heat sink is a passive device that uses fins to increase its surface area. The increased surface area exposes the heat sink to more air, which helps dissipates the heat more efficiently. The ATS-07H-30-C1-R0 is designed to act as a heat transfer and dissipation device that is used in high powered systems. It is capable of a high level of cooling performance due to its large heat dissipation area in conjunction with its effective conduction materials.
The ATS-07H-30-C1-R0 is typically used in applications requiring high power dissipations such as motor control systems, electrical power converters, and industrial machinery. It is an extremely efficient device for dissipating heat without consuming much power or energy. The ATS-07H-30-C1-R0 is also a cost-effective solution in comparison to other types of heat sinks, making it a popular choice in many industries.
The working principle of the ATS-07H-30-C1-R0 is primarily based on four components, heat conduction, thermal convection, heat radiation and thermoelectric cooling. The conduction process involves the transfer of thermal energy from one component to another through direct contact. The thermal convection process involves the transfer of thermal energy from one component to another by using a liquid or gas as the heat transfer medium. Heat radiation is the process of radiating thermal energy from one component to another, and the thermoelectric cooling process uses a semiconductor device to cool the component.
The ATS-07H-30-C1-R0 is an excellent heat sink for its application field. It is capable of providing a high level of cooling performance while consuming minimal power and energy. Additionally, it is a cost-effective solution when compared to other types of heat sinks. It has a unique combination of features that make it an ideal choice for various industrial applications. With its efficient heat dissipation and excellent thermal performance, the ATS-07H-30-C1-R0 is a great choice for any heat sink requirement.
The specific data is subject to PDF, and the above content is for reference