ATS-07H-37-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-07H-37-C2-R0-ND

Manufacturer Part#:

ATS-07H-37-C2-R0

Price: $ 5.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X17.78MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07H-37-C2-R0 datasheetATS-07H-37-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.39028
30 +: $ 5.09061
50 +: $ 4.79128
100 +: $ 4.49177
250 +: $ 4.19232
500 +: $ 3.89287
1000 +: $ 3.81801
Stock 1000Can Ship Immediately
$ 5.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.12°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical aspect of all electronic systems. Heat sinks are used to improve conduction and reduce the temperature of a component or system. The ATS-07H-37-C2-R0 is a thermal management solution designed to facilitate efficient heat transfer from a component or system to the surrounding environment. The ATS-07H-37-C2-R0 is a high-performance, ultra-thin heat sink, which is designed for applications requiring a minimal thermal profile. This heat sink is ideal for applications such as surface-mount circuits, where efficient heat transfer and a slim profile is necessary.

The ATS-07H-37-C2-R0 has been designed for use in high-performance electrical and electronic systems. It is an ultra-slim heat sink with a low thermal resistance and exceptional resistance to thermal shock. The slim profile of the ATS-07H-37-C2-R0 allows for efficient air or liquid cooling of components, while minimizing the overall size of the system.

The ATS-07H-37-C2-R0 features a fin pattern that is optimized for improved thermal performance and for higher airflow velocity, resulting in a higher thermal efficiency. The fins are also designed to improve heat dissipation over a large area, to ensure even temperature distribution across the entire component or system. Additionally, the heatsink features a combination of advanced aluminum alloys and a high-performance thermal interface material that provides a low-resistance interface between the heatsink and the component or system being cooled.

The ATS-07H-37-C2-R0 is designed to work in combination with other forms of cooling, such as active air cooling, liquid cooling, or forced air cooling, depending on the specific requirements of the application. The ATS-07H-37-C2-R0 is an extremely reliable solution that offers good thermal performance in a slim profile. This makes it an ideal choice for applications where a slim form factor and reliable thermal performance are required.

The working principle of the ATS-07H-37-C2-R0 is relatively simple. The heat sink is designed to absorb any excessive heat generated by the component or system and facilitates its transfer to the surrounding air or liquid. Once the heat has been absorbed, the fins of the ATS-07H-37-C2-R0 help facilitate efficient heat dissipation across a larger area. This allows the heat to dissipate naturally before it reaches the component or system, thus reducing the temperature of the entire system.

The ATS-07H-37-C2-R0 is suitable for a broad range of industrial and technical applications, such as LED lighting, handheld devices, computer servers, and many others. It can be adapted for use in a wide variety of environments as well, from low-temperature to high-temperature environments. The ATS-07H-37-C2-R0 is an excellent choice for any application that requires a slim profile with reliable thermal performance.

The specific data is subject to PDF, and the above content is for reference

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