| Allicdata Part #: | ATS-07H-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-07H-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07H-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are used for cooling of mechanical and electrical devices. They are designed to dissipate heat from a component or device so that it doesn\'t overheat. ATS-07H-73-C1-R0 is a particular type of thermal heat sink that is designed for specific applications.
The ATS-07H-73-C1-R0 is a three-piece, high-efficiency heat sink. It is constructed with aluminum heat sink sheets and features a single layer of uniform finning, allowing for even heat distribution. This heat sink also has an improved thermal performance over other, single-layer heat sinks. The flat top and side walls provide improved mounting stability and heat dissipation capability.
The main component of the ATS-07H-73-C1-R0 is a body that is totally integrated. This feature ensures a highly efficient heat transfer and eliminates the need for extra accessories. The body is made of high-duty aluminum and has a thermal conductivity that is three times higher than other aluminum alloy heat sink bodies.
In terms of applications, the ATS-07H-73-C1-R0 is often used as a cooling solution for LEDs, amplifiers, power supplies, and high-end gaming systems. It is well suited for applications that require an efficient thermal solution with a low profile. In addition, this heat sink can also be used for cooling of high-speed processors, graph cards, or other components that generate a lot of heat.
In terms of the working principle of the ATS-07H-73-C1-R0, it utilizes a combination of forced convection, conduction, and radiation to efficiently dissipate heat away from components. Forced convection is achieved by the use of a fan or airflow. In combination with the finning, this helps to create an air curtain that will help to increase the speed of airflow and heat transfer. Conduction works by allowing heat to transfer directly from the component to the heat sink body. Radiation helps to dissipate heat from the component into the surrounding environment.
In order to take full advantage of the cooling capabilities of the ATS-07H-73-C1-R0, proper installation is essential. The heat sink must be installed in a location where its fins can have enough air flow to maximize cooling. The heat sink should also be mounted securely onto the component in order to ensure proper contact with the components surface and an efficient heat transfer.
The ATS-07H-73-C1-R0 is an effective thermal heat sink that can be used for many different applications. It is constructed with an aluminum body and features a single layer of finning for uniform heat distribution. This heat sink also offers improved thermal performance over other single-layer heat sinks. It uses a combination of forced convection, conduction, and radiation to efficiently dissipate heat from components. Proper installation and airflow are essential in order to take full advantage of its cooling capabilities.
The specific data is subject to PDF, and the above content is for reference