| Allicdata Part #: | ATS-07H-83-C1-R0-ND |
| Manufacturer Part#: |
ATS-07H-83-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-07H-83-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44736 |
| 30 +: | $ 3.35433 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor for ensuring the optimum performance of devices such as electronic components and components that generate heat. Heat sinks are often used to dissipate heat, and ATS-07H-83-C1-R0 is one of the components commonly used to provide maximum thermal performance. In this article, we will discuss the application fields and working principle of ATS-07H-83-C1-R0.
The ATS-07H-83-C1-R0 heat sink is widely used in a variety of applications, from consumer electronics to industrial electronics. It is a high-performance heat sink designed to provide maximum thermal dissipation in confined spaces. The heat sink is also designed to be compatible with a variety of components, including processors, graphics cards, LED lighting, and more. In addition, it is designed to be compatible with a variety of different mounting systems, making it easy to install.
The ATS-07H-83-C1-R0 heat sink works in two ways. The first way is by providing cooling through its fin design. The fins provide additional surface area for heat to dissipate, allowing the component to operate at lower temperatures. The second way the heat sink works is by providing higher airflow. The heat sink’s design facilitates an increased airflow, which helps to cool the component even further.
The ATS-07H-83-C1-R0 heat sink is also designed to provide a maximum thermal performance in a small package. It is highly efficient and can dissipate heat quickly without taking up too much space. The heat sink is also designed to be lightweight and easy to install. Additionally, the heat sink is designed to be aesthetically pleasing, making it a great choice for any application.
Overall, the ATS-07H-83-C1-R0 heat sink is an ideal choice for any application that requires thermal performance in a small package. It is designed for maximum cooling, and it is easy to install and aesthetically pleasing. It is the perfect choice for applications ranging from consumer electronics to industrial electronics.
The specific data is subject to PDF, and the above content is for reference
ATS-07H-83-C1-R0 Datasheet/PDF