| Allicdata Part #: | ATS13728-ND |
| Manufacturer Part#: |
ATS-07H-99-C2-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07H-99-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to transfer heat away from electronic components or systems so that the components or systems are properly cooled. And Thermal-Heat Sinks can be classified into two categories, active and passive heat sinks. ATS-07H-99-C2-R0 belongs to the passive heat sink.
ATS-07H-99-C2-R0 is a two-stage thermal interface material (TIM) designed for use with silicon-based devices such as CPUs, GPUs, and memory modules. It features a high amount of thermal energy dissipation that enables efficient cooling capability for the silicon-based components. It consists of a first stage TIM with superior thermal conductivity and a second stage TIM with superior insulation capabilities.
The application field of ATS-07H-99-C2-R0 is mainly centered around active cooling and thermal management of computer components. It can be used on CPUs, GPUs, memory modules, chipset and other types of computer components. It can also be used as a thermal interface between computer components and heat sinks to improve the cooling performance. In addition, its low thermal resistance and excellent insulation features make it an ideal solution for efficient thermal management.
The ATS-07H-99-C2-R0 thermal interface material has a few advantages over other thermal interface materials. Firstly, its high thermal conductivity helps to transfer the heat away from the components quickly. Secondly, it has great insulation properties that help keep the components cool despite external heat sources. Finally, its low thermal resistance makes it a reliable option for thermal management and efficient cooling.
The working principle of ATS-07H-99-C2-R0 is based on the concept of thermal conduction. It makes use of the thermal properties of the material to facilitate the transfer of heat away from the component. Heat is transferred from the component via thermal conduction to the TIM. The TIM then dissipates the heat quickly to the outside environment. As a result, the component is kept cool while the TIM offers superior insulation to the surrounding components and environment.
With its superior thermal conductivity and insulation properties, ATS-07H-99-C2-R0 is an ideal solution for computer components and thermal management. It improves the cooling performance of the component by dissipating heat more quickly and efficiently. In addition, its low thermal resistance helps to keep the component temperature low. Its versatile application within the computer component cooling field makes it an ideal thermal management solution.
The specific data is subject to PDF, and the above content is for reference