| Allicdata Part #: | ATS-08A-06-C1-R0-ND |
| Manufacturer Part#: |
ATS-08A-06-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08A-06-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.15°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components in the modern electronics industry. Their purpose is to dissipate the heat created by electronic components as they operate. This dissipation of heat is achieved by the use of a thermal interface material, such as a paste or pad, which transfers the heat away from the component to a surrounding heat sink. This heat sink then dissipates the heat by making contact with a larger surface area; typically a metal plate or sheet. ATS-08A-06-C1-R0, a type of heat sink, is widely used in a variety of applications, from consumer electronics to industrial machines.
ATS-08A-06-C1-R0 is a highly efficient thermal management solution. It provides maximum cooling efficiency for minimal space requirements, making it an ideal choice for laptops, notebooks, tablets, servers and high-end computing systems. The heat sink is constructed using an aluminum base plate and fin structure to maximize heat radiation. The finned design of the heat sink provides greater surface area, which increases thermal efficiency and allows air to freely circulate around the heatsink. The heatsink is further enhanced by the use of a custom-designed fan which increases air flow and ensures optimal cooling.
The ATS-08A-06-C1-R0 thermal management solution is designed to accommodate a wide range of applications. Its durable construction, along with its ease of installation and removal allow it to be used in both industrial and consumer settings. The heat sink is designed to fit to a wide variety of motherboards and processors, allowing it to be used in servers, telecom equipment, and consumer electronics. The heat sink is also designed to operate in temperatures ranging from -40°C to +100°C, making it suitable for use in a wide range of environments.
The ATS-08A-06-C1-R0 is a highly effective solution for dissipating heat in a wide range of applications. The heat sink utilizes a series of fins that are designed to increase the surface area of the heat sink, allowing more heat to be dissipated efficiently. The combination of the fins and the use of a fan allows the ATS-08A-06-C1-R0 to efficiently dissipate heat, keeping components cool even under high load. Additionally, the heat sink is easy to install and remove, making it an attractive thermal management solution for many applications.
The specific data is subject to PDF, and the above content is for reference