ATS-08A-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08A-10-C1-R0-ND

Manufacturer Part#:

ATS-08A-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08A-10-C1-R0 datasheetATS-08A-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an important tool in dissipating heat generated from electrical components and control systems. A significant advancement in this area is the ATS-08A-10-C1-R0 Heat Sink, which is designed to be used with semiconductor applications as well as industrial applications. Here, we will discuss the application field and working principle of the ATS-08A-10-C1-R0 Heat Sink.

The ATS-08A-10-C1-R0 Heat Sink is used in many different applications ranging from semiconductor applications to motor control systems. In semiconductor applications, the heat sink acts to remove heat from the component so that it can function efficiently. This helps to reduce the amount of power consumed by the component, as well as the amount of heat generated. In motor control systems, the heat sink acts to absorb heat generated by the system, allowing it to operate at a lower temperature. Additionally, the heat sink is often used to dissipate heat from large mechanical components such as motors and generators.

The working principle of the ATS-08A-10-C1-R0 Heat Sink is based on convection. This is the process by which heat is transferred from a higher temperature area to a lower temperature area. In this case, the heat generated from the electrical components and control system is absorbed by the heat sink, which then dissipates the heat to the surrounding air. This process allows the electrical components and control systems to remain at a cooler temperature, while dissipating heat more efficiently.

The ATS-08A-10-C1-R0 Heat Sink features a unique two-layer design with an integrated fan. The first layer is designed to absorb the heat, while the second layer is designed to radiate the heat away, allowing it to dissipate more quickly and efficiently. The fan also helps to dissipate the heat more quickly, allowing the temperature of the electrical components and control systems to remain lower.

In addition to dissipating the heat generated by the electrical components and control systems, the ATS-08A-10-C1-R0 Heat Sink also has several advantages. One of the most important is its small size, which makes it easy to install on even the most confined spaces. Additionally, its light weight and low price make it an ideal choice for a variety of different applications, from semiconductor applications to motor control systems.

In conclusion, the ATS-08A-10-C1-R0 Heat Sink is an ideal choice for dissipating heat from electrical components and control systems. Its small size and low price make it a great option for many applications, while its two-layer design and integrated fan help to dissipate the heat more efficiently. As such, the ATS-08A-10-C1-R0 Heat Sink is a great tool for both semiconductor and motor control applications.

The specific data is subject to PDF, and the above content is for reference

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